Die-to-Die Interposer Links With Simultaneous Bidirectional Traces

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Solution Overview

Problem

Existing die-to-die communication systems are limited by the number of conductive traces due to surface area constraints, which restricts bandwidth and increases complexity, necessitating a solution that reduces trace count while maintaining or enhancing bandwidth.

Innovation Solution

Implementing simultaneous bi-directional (SBD) data lanes using a single conductive trace with paired transceivers for each lane, employing source-synchronous clocking and error correction to manage interference and fluctuations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a single conductive trace is used for bidirectional communication, then the number of traces is reduced by half, but signal interference and fluctuations increase

Engineering Contradiction:
Improvenumber of conductive tracesVSAvoidsignal interference and fluctuations
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent combines two unidirectional communication channels into a single bidirectional conductive trace. Transceivers on opposite dies simultaneously transmit and receive signals over the same physical trace, effectively merging two separate communication paths into one shared medium. This reduces the total trace count by half while maintaining full duplex communication capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements feedback mechanisms through error correction codes and signal conditioning circuits that detect and compensate for interference and fluctuations in real-time. The system continuously monitors signal quality and adjusts transmission parameters to maintain reliable communication despite the shared medium's inherent interference.

Inventive Principle:
Principle #23Feedback

2Productivity

If simultaneous bi-directional communication is implemented on a single trace, then bandwidth is doubled for the same trace count, but device complexity increases due to paired transceivers and error correction

Engineering Contradiction:
ImprovebandwidthVSAvoidpaired transceivers and error correction circuitry
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent makes each conductive trace universal by enabling it to carry both transmit and receive signals simultaneously. Each trace serves multiple functions (bidirectional data transmission, clock signaling, and error correction) that would traditionally require separate dedicated traces, thereby doubling the effective bandwidth capacity without increasing the physical trace count.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces intermediary error correction codes and signal conditioning circuits that mediate between the transmitted signals and the received signals. These intermediaries detect, correct, and compensate for signal degradation, allowing reliable high-speed communication over the shared trace despite the increased complexity of the transceiver interfaces.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If the number of conductive traces is reduced, then surface area constraints are relieved, but communication reliability decreases due to interference

Engineering Contradiction:
Improvesurface area on dieVSAvoidcommunication reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

By merging two separate unidirectional traces into one bidirectional trace, the patent reduces the total trace count and frees up valuable die surface area. This consolidation maintains communication reliability through simultaneous full-duplex operation and integrated error correction, achieving both space efficiency and reliable communication.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250358091A1Die-to-die interface using simultaneous bidirectional links on an interposer
Publication Date: 2025.11.20 NVIDIA CORP
  • US20250358091A1 patent drawing
  • US20250358091A1 patent drawing
  • US20250358091A1 patent drawing

AI summary

A first device includes a transceiver to communicate with a second device over an interposer, the interposer comprising a plurality of conductive traces between the first device and the second device. The first device also includes control logic, coupled to the transceiver associated with the first device, configured to send first data to the second device over a conductive trace of the plurality of conductive traces, simultaneously receive second data from the second device over the conductive trace, and extract the second data from a combined signal comprising the first data and the second data.