Die-to-Die Compiler for 3D IC Bump Map Generation
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Solution Overview
Problem
Existing semiconductor package design and verification processes require significant manual effort, complicating the design and verification of semiconductor packages with multiple integrated circuit dies, as they involve manual configuration of connection structures and physical arrangement.
Innovation Solution
An integrated circuit design implementation system that automatically generates design recipes, including RTL maps, physical design layouts, and bump maps, using a D2D compiler to configure and optimize the placement of bump structures for 3D ICs, reducing manual effort and improving design efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual configuration of connection structures and physical arrangement is used, then design flexibility and adaptability are maintained, but design time and manual effort increase significantly
Solution Approach 1:
The system enables self-service automation where the EDA tool automatically generates bump maps, connection structures, and physical layouts based on input specifications without requiring manual configuration of each component. The automated design flow includes automatic placement of bump structures, generation of interconnect routing, and creation of final package layouts, significantly reducing manual effort while maintaining design productivity
Solution Approach 2:
The system changes parameters from manual specification to automated generation by accepting high-level design parameters (such as die arrangements, connection requirements, and performance constraints) and automatically transforming them into detailed physical implementations. This parameter transformation approach allows the system to handle complex design spaces automatically based on input specifications rather than requiring manual configuration of each detail
2Ease of operation
If automated generation of design recipes and bump maps is implemented, then manual effort and design time are reduced, but system complexity increases
Solution Approach 1:
The system segments the complex semiconductor package design process into distinct modular stages: (1) input specification acceptance, (2) automated bump map generation, (3) connection structure creation, (4) physical layout generation, and (5) verification. Each stage is handled by specialized automated modules that process inputs and produce outputs systematically, making the overall complex process manageable through segmentation while reducing manual intervention
Solution Approach 2:
The system introduces intermediary data structures and representation layers that mediate between high-level design specifications and low-level physical implementations. These intermediaries include standardized bump map formats, connection interface definitions, and layout generation templates that translate between different design abstractions, enabling automated generation while managing system complexity through standardized intermediate representations
3Reliability
If symmetric disposal of bump structures is enforced, then signal transmission reliability is improved, but design flexibility is reduced
Solution Approach 1:
The system implements dynamic enforcement of symmetry based on specific design requirements rather than rigid fixed symmetry. The automated tool can adjust bump structure arrangements to achieve optimal symmetry for signal transmission while allowing deviations when necessary for adaptability. This dynamic approach enables the system to maintain reliability through symmetry where beneficial while providing flexibility when design constraints require asymmetric configurations
Data Source
AI summary
An integrated circuit design implementation system includes a die-to-die (D2D) complier configured to receive a configuration of a semiconductor package. The semiconductor package includes a first semiconductor die and a second semiconductor die bonded to each other. The D2D compiler is configured to generate, based on the configuration of the semiconductor package, a first bump map and a second bump map for the first semiconductor die and the second semiconductor die, respectively. The first bump map indicates respective locations of a plurality of first bump structures of the first semiconductor die, and the second bump map indicates respective locations of a plurality of second bump structures of the second semiconductor die.