Die-to-die interface configuration for power reduction
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Solution Overview
Problem
Conventional die-to-die interfaces in multi-die packages require large clock trees and inefficient use of space due to distributed sequential logic circuits and ESD circuitry, leading to increased metal and capacitance, which in turn increases power consumption and reduces area efficiency.
Innovation Solution
Separating input/output (I/O) and electrostatic discharge (ESD) circuitry from the die contacts, allowing for a compact clock tree and efficient use of space by placing I/O circuitry and ESD devices in a distinct area, with data drivers and ESD protection devices coupled to electrical contacts, and implementing serializers and deserializers to reduce the number of contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If sequential logic circuits are distributed underneath or near the contacts array, then each contact can be directly associated with its logic circuit, but the clock trees become large and require longer metal traces, increasing total metal and capacitance
Solution Approach 1:
The patent segments the die into distinct functional areas: a contacts area containing the array of electrical contacts, and a logic circuits area containing the sequential logic circuits. This spatial segmentation allows each area to be optimized independently, reducing clock tree size while maintaining functional associations through controlled routing.
Solution Approach 2:
The patent transitions from a two-dimensional distributed layout (logic circuits scattered under contacts) to a separated zonal layout (contacts area and logic circuits area as distinct regions). This dimensional reorganization reduces the spatial footprint of clock trees while preserving functional connectivity.
2Device complexity
If flip-flops, drivers, and ESD circuitry are placed underneath or near the contacts, then signal routing is simplified, but space utilization becomes inefficient and reduces area available for other circuitry
Solution Approach 1:
The patent divides the die into functionally segregated zones: a contacts area for electrical contacts and a logic circuits area for sequential logic circuits, drivers, and ESD circuitry. This segmentation consolidates related components, simplifying interconnections while maximizing the remaining area for other circuitry.
Solution Approach 2:
The patent merges the drivers and ESD circuitry with the sequential logic circuits in the logic circuits area, creating a consolidated functional block. This merging reduces the number of separate component placements needed and optimizes space utilization while maintaining signal routing efficiency.
3Productivity
If contacts are arranged in a large array to support high data bandwidth, then connectivity density increases, but the surface area required for the contacts array increases
Solution Approach 1:
The patent reorganizes the contacts array into a compact, densely packed configuration within a reduced footprint area. By optimizing the spatial arrangement and utilizing vertical stacking where applicable, the patent achieves high connectivity density without proportionally increasing the die area occupied by the contacts array.
Data Source
AI summary
A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.