Die Surface Topography Sensing for Precise Die Bonding Alignment
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Solution Overview
Problem
In semiconductor manufacturing, achieving accurate and fast placement of semiconductor dies with respect to each other is crucial for heterogeneous integration, particularly due to the complexity and miniaturization of IC components, where existing techniques struggle to account for variations in topography and contamination that affect alignment and bonding quality.
Innovation Solution
A sensor system is employed to determine the topography and contamination characteristics of semiconductor dies using a radiation emission system with a flat wavefront and a radiation detector, enabling precise alignment and bonding by measuring flatness and detecting particles on the die surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional alignment techniques are used for die placement, then the process is simpler and faster, but accuracy deteriorates due to inability to account for topography variations and contamination
Solution Approach 1:
The sensor system performs preliminary measurement of die topography and contamination before the bonding process. By qualifying the die surface characteristics in advance, the system enables accurate alignment compensation without adding complexity to the actual bonding operation, resolving the contradiction between measurement precision and device complexity
Solution Approach 2:
The sensor system acts as an intermediary between the die surface and the alignment system. It measures topography and contamination, converts this information into actionable data, and enables the alignment system to compensate for variations, thereby improving alignment accuracy without directly increasing bonding process complexity
2Measurement precision
If conventional die placement methods are used, then throughput is maintained at current levels, but accuracy deteriorates due to lack of topography and contamination assessment
Solution Approach 1:
The sensor system is integrated into the existing die placement workflow, allowing measurement and alignment qualification to occur continuously as part of the bonding process preparation. This eliminates separate measurement steps that would add time loss, while still achieving improved placement accuracy through topography and contamination assessment
Solution Approach 2:
The system replaces complex mechanical alignment adjustment methods with optical sensing and computational analysis. By using radiation-based measurement and data processing to determine alignment characteristics, the system achieves higher placement accuracy without the time-consuming manual or mechanical adjustment iterations
3Manufacturing precision
If no topography qualification is performed, then the process is faster and simpler, but manufacturing precision deteriorates due to unaccounted surface variations
Solution Approach 1:
Topography qualification is performed as a preliminary step before bonding, enabling accurate compensation for surface variations in advance. This prevents bonding defects without requiring rework or repeated measurements, thereby maintaining high processing throughput while improving manufacturing precision
Solution Approach 2:
The sensor system provides feedback on die surface topography and contamination characteristics, enabling real-time adjustment of alignment and bonding parameters. This feedback loop ensures high bonding quality by accounting for surface variations, while the automated nature of the feedback process maintains productivity without manual intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and throughput of die placement and bonding by ensuring proper alignment and cleanliness, reducing defects and improving the integration quality of semiconductor devices.
Implementation Method 1
a radiation emission system configured to emit radiation having a substantially flat wavefront; and a radiation detector configured to detect at least some of the radiation after reflection by the one or more semiconductor dies
Data Source
Figure 1A~1C
Figure 1D
Figure 2A~2B
AI summary
A sensor and method of operating the sensor, the sensor configured to determine a characteristic of a topography of a surface of one or more semiconductor dies for die bonding, the sensor including a radiation emission system configured to emit radiation having a substantially flat wavefront; and a radiation detector configured to detect at least some of the radiation after reflection by the one or more semiconductor dies to determine the characteristic of the topography of the surface of the one or more semiconductor dies.