Semiconductor Die Transfer Bridge for Direct Substrate Mounting
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Solution Overview
Problem
Conventional semiconductor device fabrication processes result in packaged devices that are significantly larger and thicker than the underlying die, limiting the thickness and compactness of circuit assemblies.
Innovation Solution
A machine and process for directly transferring and affixing unpackaged semiconductor device die to a circuit substrate, bypassing traditional packaging steps, thereby reducing the thickness and volume of the final product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging process is used, then device protection and interface capability are improved, but device thickness and volume increase significantly
Solution Approach 1:
The patent extracts the essential protective and interconnection functions from the traditional bulky packaging structure and implements them through direct die mounting on circuit substrates. The die are directly affixed to the substrate with conductive connections, eliminating the need for separate packaging housings and reducing volume by approximately 100 times compared to conventional packaged devices.
Solution Approach 2:
The invention transitions from three-dimensional packaged devices to a more planar, integrated structure where die are mounted directly on circuit substrates. This dimensional reorganization allows the circuit assembly to be much thinner and more compact, as the protective and interconnection functions are integrated into the substrate plane rather than requiring vertical packaging structures.
2Reliability
If conventional packaging process is used, then device protection is improved, but manufacturing time and costs increase
Solution Approach 1:
The patent merges multiple separate manufacturing steps (die preparation, packaging, and circuit assembly) into a single integrated process. Die are directly transferred and affixed to circuit substrates in one operation, combining what were previously distinct packaging and assembly steps. This consolidation eliminates intermediate handling and reduces overall manufacturing time and complexity.
Solution Approach 2:
The invention employs preliminary sorting and selection of die based on quality parameters (forward voltage capacity, average power, wavelength) before the direct mounting process. This preliminary action ensures that only qualifying die are transferred to substrates, maintaining product reliability while streamlining the manufacturing process by preventing defective die from requiring rework or rejection later.
3Volume of moving object
If die are directly transferred without packaging, then device thickness is reduced, but device protection capability is compromised
Solution Approach 1:
The circuit substrate serves multiple functions simultaneously: it provides mechanical support for the die, establishes electrical connections through conductive traces, and offers environmental protection through the substrate material itself. This multi-functionality eliminates the need for separate packaging structures while maintaining device protection, allowing direct mounting without compromising reliability.
4Manufacturing precision
If pick and place sorting process is used, then die quality control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent introduces an intermediary sorting and selection process that evaluates die quality parameters (forward voltage capacity, average power, wavelength) and directs qualifying die to mounting positions. This intermediary step acts as a quality gatekeeper, ensuring only acceptable die proceed to the direct mounting process, thereby maintaining manufacturing precision while organizing the complexity into a systematic workflow.
Data Source
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AI summary
An apparatus for transferring a semiconductor die ("die") from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.