Die Transfer Alignment on Flexible Film Using Ejector Calibration
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Solution Overview
Problem
Existing transfer apparatuses face challenges in achieving accurate alignment and preventing die overturning or skewing during the transfer of objects from a thin film to a Printed Circuit Board (PCB) due to the large area and elasticity of the thin film, resulting in low production yield.
Innovation Solution
A method and apparatus that includes a movable placement device, a pressing member, and an ejector, where the pressing member presses the first substrate towards the second substrate to control tension, and an image capturing device adjusts the position of the first substrate based on calibration information to ensure precise alignment and avoid die overturning or skewing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the ejector ejects directly to the dies on the thin film, then the transfer process is simple and fast, but accurate alignment cannot be achieved and dies are easily overturned or skewed
Solution Approach 1:
The patent applies preliminary action by performing image capture and position calibration of the dies on the thin film before the ejection process. The system captures images of the dies, calculates their actual positions, and determines correction values for each die's position. This preliminary measurement and calculation step ensures that when ejection occurs, the alignment has already been optimized based on the actual die positions, thereby achieving both high transfer speed and high alignment accuracy.
2Adaptability or versatility
If the thin film has large area and elasticity, then the transfer process is flexible, but accurate alignment is hardly achieved
Solution Approach 1:
The patent implements feedback by using an image capture device to detect the actual positions of the dies on the flexible thin film. The system calculates position correction values based on the detected positions and applies these corrections during the ejection process. This feedback mechanism compensates for the elasticity and large area of the thin film, maintaining alignment accuracy despite the film's flexibility.
3Device complexity
If the ejector moves in a straight line for ejection, then the mechanism is simple, but the object cannot be properly positioned for detection
Solution Approach 1:
The patent applies dimensionality change by making the ejector movable not only in the vertical ejection direction but also in the horizontal plane. The ejector can move to different positions corresponding to each die's location on the thin film. This additional degree of freedom allows the ejector to position itself directly over each die before ejection, enabling both simple operation and precise detection without complicating the overall mechanism.
Data Source
AI summary
A method for transferring objects and a transfer apparatus using the same are provided. The method includes the following steps: controlling, during a first period, the ejector at an ejecting working position to perform an ejecting process along with a first direction, to transfer the object from the first substrate to the second substrate; controlling, during a second period, the ejector to move to an ejecting standby position along with a second direction which is non-parallel to the first direction, to expose at least one of the object on the first substrate to a detection range of an image capturing device; detecting the position of the object in the detection range to obtain calibration information; and adjusting the position of the first substrate according to the calibration information.