Semiconductor Die Direct Transfer With Micro-Adjustment Alignment
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Solution Overview
Problem
Conventional semiconductor device transfer processes are inefficient due to lack of control over parameters such as vibration and speed, leading to inaccuracies and increased costs, especially when handling large volumes of small, thin semiconductor die.
Innovation Solution
A direct transfer apparatus and method that includes a micro-adjustment mechanism to precisely align and transfer unpackaged semiconductor die from a wafer tape to a support substrate, using a system of gears, motors, and sensors to minimize vibration and optimize alignment, allowing for continuous motion and reduced settling time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high speed transfer is used to increase productivity, then transfer rate improves, but vibration increases causing inaccuracies
Solution Approach 1:
The system applies preliminary anti-action by using active vibration cancellation mechanisms that generate counter-vibrations to offset the harmful vibrations produced during high-speed die transfer. Sensors detect the vibration patterns and the system responds by applying opposing forces to neutralize the detrimental effects, allowing high-speed operation without sacrificing accuracy.
Solution Approach 2:
The system dynamically changes operational parameters such as acceleration profiles, transfer speed, and positioning timing to optimize the balance between productivity and vibration control. By adjusting these parameters in real-time based on feedback from sensors, the system maintains high transfer rates while minimizing vibration-induced inaccuracies.
2Productivity
If conventional transfer mechanisms are used to handle large volumes of die, then productivity is maintained, but control over vibration and speed parameters is lost
Solution Approach 1:
The system implements comprehensive feedback mechanisms using sensors to continuously monitor vibration levels, position accuracy, and transfer speed. This real-time data feeds back to the control system, which automatically adjusts operational parameters to maintain optimal performance. The feedback loop enables precise control over vibration and speed while handling large volumes of die, resolving the contradiction between productivity and parameter control.
3Reliability
If packaging is used to protect semiconductor devices, then device protection improves, but device thickness increases
Solution Approach 1:
The system extracts the protective function from the traditional packaging structure by implementing protective measures at the die level and during transfer, rather than relying on thick external packages. The direct transfer methodology allows die to be moved and positioned with precision while maintaining protection through controlled handling environments, eliminating the need for bulky packaging and reducing overall device thickness.
Data Source
AI summary
An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.