Die Transfer Ejector and Picker Timing for Thin Die Handling
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Solution Overview
Problem
Existing methods for transferring thin dies in semiconductor manufacturing face challenges in minimizing shock and damage during the picking process, particularly as dies become thinner and more delicate.
Innovation Solution
An apparatus and method utilizing an ejector and picker system with controlled vacuum and pneumatic pressure to detach dies from a dicing tape in a non-contact manner, involving a gas passage for pressure application and a picker controller to manage the transfer process, ensuring minimal contact and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional contact-based picking method is used, then transfer speed is maintained, but shock and damage occur to thin dies
Solution Approach 1:
The patent replaces the conventional mechanical contact-based picking system with a pneumatic system. The picker uses vacuum pressure applied through a gas passage to suction the die, eliminating direct mechanical contact between the picker and die. This substitution of mechanical force with pneumatic pressure resolves the contradiction by maintaining transfer capability while removing the shock and damage caused by mechanical contact.
Solution Approach 2:
The patent employs pneumatic principles throughout the transfer process. The ejector uses pneumatic pressure to push the die upward, and the picker uses vacuum pressure to suction and hold the die. This pneumatic approach allows for gentle, controlled manipulation of thin dies without the impact and stress associated with mechanical contact methods, thereby improving reliability while reducing harmful shock.
2Reliability
If vacuum pressure is applied early, then die attachment to picker is improved, but die may stick to ejector
Solution Approach 1:
The patent applies vacuum pressure to the picker in advance, before the die is fully detached from the ejector. This preliminary application of vacuum ensures the picker is ready to immediately capture the die as it rises, improving attachment reliability. The timing is carefully controlled so that vacuum is applied just as the die separates from the ejector, preventing the die from sticking to the ejector while ensuring secure capture by the picker.
Solution Approach 2:
The patent employs coordinated control of the ejector and picker based on their relative positions. The controller monitors the ejector's upward movement and triggers vacuum pressure application to the picker at the precise moment when the die is ready to transfer. This feedback-based timing coordination ensures optimal attachment to the picker while preventing unwanted adhesion to the ejector, resolving the contradiction through precise temporal control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively transfers thin dies without causing damage by using controlled vacuum and pneumatic pressures to detach and pick up dies in a non-contact state, enhancing the reliability of the transfer process.
Implementation Method 1
a gas passage disposed in the ejector and forming a gas channel for applying vacuum pressure
Implementation Method 2
the gas passage may form a channel for applying pneumatic pressure to the die
Implementation Method 3
a tape suction unit disposed outside the ejector and configured to suction the dicing tape using vacuum pressure
Implementation Method 4
the picker controller moves up the picker by a second height with vacuum pressure applied downward by the gas stream controller
Data Source
AI summary
An apparatus for transferring dies in bonding equipment includes an ejector configured to push up a die attached to a dicing tape, an ejector controller controlling the ejector to move up or move down, a gas passage disposed in the ejector and forming a gas channel for applying vacuum pressure or pneumatic pressure, a gas stream controller controlling the vacuum pressure or the pneumatic pressure through the gas passage, a tape suction unit disposed outside the ejector and suctioning the dicing tape using vacuum pressure, a picker suctioning and transferring the die from above, and a picker controller moving-up and moving down the picker.