Die Trench Cooling Assembly for Compact Hotspot Heat Dissipation
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Solution Overview
Problem
Advanced electronic and semiconductor packages face challenges in thermal management, particularly in compact form factors with high device integration, where conventional solutions like oversized thermal interface materials and heat spreaders lead to inefficiencies and increased costs, while also requiring effective hot-spot management for device reliability.
Innovation Solution
The integration of thermally conductive trenches in semiconductor dies filled with liquid metal, coupled with a stiffener and dielectric layer, enhances heat dissipation and electromagnetic shielding, allowing for miniaturization and efficient thermal management without the need for separate heat spreaders.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional oversized thermal interface material and heat spreader assembly are used, then heat spreading is improved, but system footprint and form factor increase
Solution Approach 1:
The patent embeds micro-channel heat exchanger structures directly within the semiconductor die substrate, nesting the cooling functionality inside the existing device footprint rather than adding external heat spreaders. This allows heat dissipation pathways to be integrated at the die level, maintaining compact form factor while achieving effective thermal management
Solution Approach 2:
The patent transitions from two-dimensional planar heat spreading (conventional heat spreaders) to three-dimensional vertical heat dissipation pathways through micro-channels etched into the die substrate. This vertical integration enables thermal management within the existing footprint by utilizing the depth dimension of the packaged device
2Temperature
If additional copper bumps are used to increase density of bumps for more conductive channels, then heat dissipation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the thermal management function from separate components (copper bumps, heat spreaders) and integrates it directly into the die substrate through micro-channel structures. This consolidation eliminates the need for additional discrete thermal management components, reducing device complexity while maintaining heat dissipation effectiveness
Solution Approach 2:
The die substrate is designed to serve multiple functions: as the active semiconductor device platform and as an integrated heat exchanger with micro-channels for thermal management. This multi-functionality eliminates the need for separate thermal management components, reducing overall device complexity
3Temperature
If immersion cooling or silicon-level micro-channel heat exchangers are used, then thermal dissipation efficiency is improved, but material cost and manufacturing complexity increase
Solution Approach 1:
The patent implements micro-channel heat exchanger structures at the local die level where heat generation occurs, rather than requiring system-level immersion cooling infrastructure. This localized approach achieves high thermal dissipation efficiency at the source while avoiding the material costs and manufacturing complexity of full immersion cooling systems
Solution Approach 2:
The patent modifies the physical parameters of the die substrate by etching micro-channels and filling them with thermally conductive materials, transforming the substrate into an active heat exchanger. This parameter change enables efficient thermal dissipation using standard semiconductor manufacturing processes rather than requiring specialized immersion cooling infrastructure
4Temperature
If continuous use of oversized thermal interface material is used, then heat spreading is improved, but loss of substance and material cost increase
Solution Approach 1:
The patent extracts the thermal conduction function from bulky thermal interface materials and integrates it directly into the die substrate through micro-channel structures. This eliminates the need for continuous application of oversized TIM layers, reducing material consumption and cost while maintaining effective heat spreading
Solution Approach 2:
The patent uses composite structures combining the die substrate material with integrated micro-channel heat exchanger materials, creating a unified thermal management solution that eliminates the need for separate thermal interface materials. This integration reduces material loss and cost while improving thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced thermal management and electrical performance by targeting power density hotspots with increased heat dissipation surface area, while simplifying cooling components and reducing material costs, and offering electromagnetic shielding through the conductive layer's configuration.
Implementation Method 1
a thermally conductive layer positioned in the cavity between a stiffener and the die, in which the conductive layer at least partially fills the at least one trench in the die
Implementation Method 2
offering electromagnetic shielding through the conductive layer's configuration
Data Source
AI summary
The present disclosure is directed to an electronic assembly and method of forming thereof. The electronic assembly may include a substrate and a first die with first and second opposing surfaces. The first die may be coupled to the substrate at the first surface. At least one first trench may extend partially through the first die from the second surface. A stiffener may be attached to the substrate. The stiffener may have a cavity that accommodates the first die, in which the second surface of the first die faces the stiffener. A thermally conductive layer may be positioned between the stiffener and the first die. The conductive layer at least partially fills the at least one first trench.