Semiconductor Die Vessel Workstation for Automated Cleaning Inspection
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Solution Overview
Problem
Modern manufacturing processes for semiconductor die vessels rely heavily on human skill and expertise for quality control, packaging, and maintenance, particularly in cleaning and inspection, which is inefficient and prone to errors.
Innovation Solution
An automated integrated semiconductor die vessel processing workstation that disassembles, cleans, inspects, and reassembles die vessels without manual intervention, using a conveyor system with robotic arms and automated stations for cleaning, drying, and inspection, ensuring consistency and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual processing and inspection methods are used, then human skill and expertise can be applied for quality control, but efficiency is reduced and errors are prone to occur
Solution Approach 1:
The patent replaces manual mechanical inspection and processing with an automated optical inspection system using cameras and image processing algorithms. The system captures images of semiconductor dies, processes them through computer vision algorithms, and automatically determines pass/fail status, eliminating the need for manual visual inspection while maintaining high accuracy and enabling parallel processing of multiple dies simultaneously.
Solution Approach 2:
The inspection system performs self-validation through automated image processing and analysis. The system independently captures images, processes them through algorithms, and generates inspection results without requiring human intervention, thereby achieving both high reliability through consistent algorithmic application and high productivity through automated operation.
2Measurement precision
If manual inspection methods are used, then detailed quality control can be performed, but the process is time-consuming and labor-intensive
Solution Approach 1:
The patent replaces time-consuming manual inspection with rapid automated optical inspection. Multiple cameras capture images of multiple semiconductor dies simultaneously, and image processing algorithms quickly analyze the images to determine inspection results, reducing inspection time from minutes per die to fractions of a second while maintaining or improving accuracy through consistent algorithmic application.
Solution Approach 2:
The system performs preliminary image capture and processing in parallel for multiple dies before final result determination. By capturing images of multiple dies simultaneously and processing them through pre-configured algorithms, the system prepares inspection results in advance, significantly reducing total inspection time while maintaining precise quality control through thorough image analysis.
3Productivity
If automated processing systems are implemented, then efficiency and consistency are improved, but device complexity increases
Solution Approach 1:
The patent divides the inspection system into modular functional segments: image capture modules with multiple cameras, image processing modules with separate algorithms for different inspection criteria, and result generation modules. This segmentation allows each component to be independently optimized and maintained, reducing overall system complexity while enabling high productivity through parallel operation of multiple modules.
Solution Approach 2:
The inspection system is designed as a universal platform capable of inspecting multiple types of semiconductor dies using the same hardware infrastructure. The system uses multiple cameras that can capture different views and applies configurable image processing algorithms that can be adapted to various die types and inspection requirements, achieving high productivity across different products without proportionally increasing system complexity.
Data Source
AI summary
In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.