Automated Die Vessel Warehousing for Semiconductor Processing
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Solution Overview
Problem
Modern manufacturing processes, particularly in semiconductor die processing, rely heavily on human skill for quality control and maintenance, which can be inefficient and prone to errors due to the lack of automation in handling and inspection of semiconductor dies.
Innovation Solution
An automated die container warehousing system that interfaces with a semiconductor die processing tool, utilizing robotic arms to manage and transport die vessels and containers between in-port, out-port, and buffer regions, enabling efficient storage, processing, and reprocessing of semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated systems are used to handle and inspect semiconductor dies, then productivity and manufacturing precision are improved, but device complexity increases
Solution Approach 1:
The automated handling system is divided into separate functional modules: a robotic arm for transport, a buffer region for temporary storage, and an inspection tool for quality control. This segmentation allows each component to be optimized independently while maintaining overall system productivity and managing complexity through modular design.
Solution Approach 2:
A buffer region acts as an intermediary between the robotic arm and the inspection tool, decoupling their operations. The buffer allows the robotic arm to continue loading dies while the inspection tool processes previous batches independently, improving productivity without requiring complex real-time coordination between components.
2Reliability
If human operators perform quality control and maintenance, then ease of operation is maintained through flexibility, but reliability and measurement precision deteriorate due to human error
Solution Approach 1:
The inspection tool autonomously performs quality control functions without human intervention during the inspection process. The system self-manages the inspection workflow, automatically evaluating semiconductor dies and identifying defects, which ensures consistent reliability while the complexity is managed through standardized automated procedures rather than human decision-making.
3Loss of time
If buffer regions are added to the warehousing system, then loss of time is reduced by enabling parallel operations, but device complexity increases
Solution Approach 1:
The buffer region is prepared in advance as a temporary storage location, allowing the robotic arm to continuously load semiconductor dies without waiting for the inspection tool to complete its cycle. This preliminary preparation of the buffer enables parallel operations and reduces idle time, while the buffer's simple storage function adds minimal complexity compared to complex coordination mechanisms.
Data Source
AI summary
In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.