Die-to-Wafer Bonding Paired Offset Contact Alignment
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Solution Overview
Problem
Mechanical misalignments between semiconductor dies during manufacturing lead to open circuit and short circuit defects due to equipment accuracy limitations, reducing device yields and reliability.
Innovation Solution
Employing a paired offset in the connection pitch of semiconductor die contacts and utilizing configurable interface circuitry to redirect data from defective to non-defective signaling paths, allowing for reduced connection pitch and increased data throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If connection pitch is reduced to increase density, then productivity is improved, but manufacturing precision deteriorates due to equipment accuracy limitations causing misalignment
Solution Approach 1:
The patent applies preliminary action by pre-configuring redundant signaling paths and establishing alternative routing options before misalignment occurs. The interface circuitry is designed in advance with multiple possible connection paths, allowing the system to proactively handle potential misalignment issues without requiring real-time adjustments during bonding.
Solution Approach 2:
The patent implements dynamics by making the signaling path configuration adjustable and reconfigurable. The interface circuitry can dynamically select between different connection paths based on actual alignment results, transforming a static connection architecture into a flexible system that adapts to manufacturing variations.
2Reliability
If configurable interface circuitry is added to redirect data paths, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by designing interface circuitry that performs multiple functions: normal data signaling, misalignment detection, path selection, and redundancy management. This multi-functional approach consolidates what could be separate complex subsystems into a single integrated interface unit, improving reliability without proportionally increasing complexity.
Solution Approach 2:
The patent uses parameter changes by modifying the operational characteristics of the interface circuitry based on detected conditions. The system changes parameters such as active signaling paths, data routing configurations, and connection selections dynamically, allowing the same hardware to operate in different modes to maintain reliability across varying alignment conditions.
3Manufacturing precision
If redundant contacts are implemented to compensate for misalignment, then manufacturing precision is improved, but area increases
Solution Approach 1:
The patent applies another dimension by transitioning from a purely spatial redundancy approach (adding more contacts in the same plane) to a dimensional solution where alternative paths are created through different routing layers or vertical stacking. This allows redundant paths to be implemented without proportionally increasing the lateral footprint of the contact array.
Data Source
AI summary
Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a semiconductor device is disclosed. The semiconductor device includes a first semiconductor die having a first bonding surface that is formed with a first set of contacts patterned with a first connection pitch. A second semiconductor die has a second bonding surface that is formed with a second set of contacts patterned with a second connection pitch. The second set of contacts are further patterned with a paired offset. The second semiconductor die is bonded to the first semiconductor die such that the first set of contacts is disposed in opposed electrical engagement with at least a portion of the second set of contacts.