Die-to-Wafer Bonding Polymer Layer for Reliability
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high performance, large capacity, miniaturization, and lightweight designs due to limitations in bonding reliability between semiconductor dies and wafers, particularly in ensuring strong and reliable bonding despite surface uniformity issues and material compatibility.
Innovation Solution
A die-to-wafer bonding structure is developed, featuring a polymer layer that surrounds bonding pads on both the die and wafer, with the polymer layer being cured to a high degree for strong bonding, and heat treatment is used to form a robust bond between the die and wafer, filling voids and enhancing bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct bonding between bonding pads is performed, then bonding reliability is improved, but surface uniformity issues cause bonding failures
Solution Approach 1:
A polymer layer is introduced as an intermediary material between the bonding pads on the die and wafer. This polymer layer fills surface irregularities and non-uniformities, enabling reliable bonding even when the underlying surfaces are not perfectly uniform. The polymer acts as a mediator that compensates for surface defects while maintaining electrical connectivity through the bonding pads.
2Reliability
If polymer layer is used to fill voids and enhance bonding, then bonding reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The polymer layer undergoes curing parameter changes to transform from a liquid or paste state to a solid state, filling voids and creating a robust bonding interface. By controlling curing parameters such as temperature, time, and pressure, the process achieves reliable bonding without requiring complex multi-step manufacturing procedures. The phase transition of the polymer simplifies the overall manufacturing complexity.
3Strength
If heat treatment is applied to form robust bond, then bonding strength is improved, but processing time increases
Solution Approach 1:
Heat treatment induces phase transitions in the polymer layer, transforming it from a soft, uncured state to a hardened, cross-linked state. This phase change occurs rapidly at elevated temperatures, achieving strong bonding in a relatively short time frame. The phase transition mechanism allows for quick processing while maintaining high bonding strength, reducing the overall processing time compared to gradual cooling or aging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the productivity and reliability of semiconductor packages by ensuring a strong, uniform bond between dies and wafers, independent of surface uniformity, and prevents bonding failures, thereby enhancing the overall performance and capacity of semiconductor packages.
Implementation Method 1
the polymer layer being cured to a high degree for strong bonding
Implementation Method 2
heat treatment is used to form a robust bond between the die and wafer, filling voids and enhancing bonding reliability
Data Source
AI summary
According to an aspect of the inventive concept, there is provided a die-to-wafer bonding structure including a die having a first test pad, a first bonding pad formed on the first test pad, and a first insulating layer, the first bonding pad penetrates the first insulating layer. The structure may further include a wafer having a second test pad, a second bonding pad formed on the second test pad, and a second insulating layer, the second bonding pad penetrates the second insulating layer. The structure may further include a polymer layer surrounding all side surfaces of the first bonding pad and all side surfaces of the second bonding pad, the polymer layer being arranged between the die and the wafer. Additionally, the wafer and the die may be bonded together.