Diecast Metal Backplate for HMD Thermal and Structural Integration
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Solution Overview
Problem
Head-mounted displays (HMDs) face challenges in achieving tight structural, thermal, and electrical tolerances to support sophisticated virtual environments, requiring a backplate that provides both structural support and thermal cooling while minimizing mass for user comfort.
Innovation Solution
A single diecast metal backplate with specific mounting regions for components like cameras, IMUs, circuit boards, and fans, designed for thermal management, stiffness, and conductivity, optimized for mass production and comfort, and serving as both a structural support and thermal cooling solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional multi-component backplate structure is used, then structural support and thermal management functions can be provided, but the device mass increases and manufacturing complexity increases
Solution Approach 1:
The patent combines multiple separate components (structural backplate, thermal management elements, mounting brackets) into a single integrated backplate component. This integration maintains all necessary functions (structural support, thermal conduction, component mounting) while reducing overall mass by eliminating separate parts and assembly requirements.
Solution Approach 2:
The backplate is designed as a multi-functional component that simultaneously provides structural support, thermal management through integrated heat pipes and vapor chambers, and component mounting capabilities. This universal design consolidates multiple functions into one component, reducing the need for additional separate parts.
2Reliability
If a traditional multi-component backplate structure is used, then structural support and thermal management functions can be provided, but the device complexity increases
Solution Approach 1:
The patent combines multiple separate components (structural backplate, thermal management elements, mounting brackets) into a single integrated backplate component. This integration maintains all necessary functions (structural support, thermal conduction, component mounting) while reducing overall mass by eliminating separate parts and assembly requirements.
Solution Approach 2:
The backplate is designed as a multi-functional component that simultaneously provides structural support, thermal management through integrated heat pipes and vapor chambers, and component mounting capabilities. This universal design consolidates multiple functions into one component, reducing the need for additional separate parts.
3Reliability
If tight structural and thermal tolerances are implemented, then component performance and reliability improve, but manufacturing difficulty increases
Solution Approach 1:
The patent employs die-casting manufacturing process with controlled parameters to achieve tight tolerances for structural dimensions and thermal pathway geometries. By optimizing casting parameters (temperature, pressure, cooling rate), the process consistently produces components meeting stringent tolerance requirements while remaining manufacturable.
Solution Approach 2:
The backplate utilizes aluminum alloy material that combines structural strength with high thermal conductivity. This composite material selection enables simultaneous achievement of mechanical rigidity for structural tolerances and thermal performance for heat dissipation, while being compatible with die-casting manufacturing.
4Weight of moving object
If component mass is reduced for user comfort, then wearability improves, but structural integrity and thermal management capability deteriorate
Solution Approach 1:
The backplate utilizes thin-walled die-cast construction with optimized wall thickness distribution. Strategic thickening at high-stress regions and thinning in low-stress areas maintains structural integrity while minimizing overall mass. The thin-walled design also reduces thermal mass while maintaining thermal conduction pathways.
Solution Approach 2:
The backplate utilizes aluminum alloy material that combines structural strength with high thermal conductivity. This composite material selection enables simultaneous achievement of mechanical rigidity for structural tolerances and thermal performance for heat dissipation, while being compatible with die-casting manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the structural integrity and thermal management of HMDs, maintaining tight tolerances and user comfort by providing a lightweight yet robust and effective cooling system, ensuring reliable tracking and performance in virtual environments.
Implementation Method 1
The backplate provides structural support as well as thermal cooling for components coupled to the backplate
Implementation Method 2
a fan mounting region
Data Source
AI summary
A backplate for a head-mounted display (HMD) is disclosed. The backplate provides structural support as well as thermal cooling for components coupled to the backplate. The backplate includes a plurality of mounting regions that are used to couple components to the backplate. The mounting regions may include camera mounting regions (e.g., for inside-out tracking), an inertial measurement unit (IMU) mounting region, circuit board mounting regions, heat pipe mounting region, and a fan mounting region. The mounting regions may be specific to the component. In various embodiments, the backplate is a single diecast metal plate that includes the mounting regions designed to provide certain levels of thermal management, stiffness, and conductivity (e.g., ground) for the HMD.