Multi-Layer Dielectric Antenna with Embedded Patch for 5G
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Solution Overview
Problem
The challenge is to design an antenna for portable terminal devices that can efficiently operate across wideband frequencies while being compact in size, with improved handleability and processability, as the transition from 4G to 5G communications requires smaller physical sizes and enhanced radiation properties.
Innovation Solution
The antenna is configured with multiple dielectric layers, including an organic binder and inorganic filler, with an adhesive layer in between, and features a patch pattern with a larger number of metal layers and a coupling pattern with fewer metal layers, formed using a plating process, allowing for reduced size and improved radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna size is reduced for portable terminal devices, then the physical size decreases, but the radiation efficiency deteriorates
Solution Approach 1:
The patent uses a composite dielectric layer comprising an organic binder and inorganic filler (such as ceramic particles) to achieve high dielectric constant while maintaining mechanical flexibility. This composite structure enables compact antenna design with improved radiation efficiency by confining electromagnetic energy more effectively in a smaller volume.
Solution Approach 2:
The patent transitions from planar 2D antenna patterns to 3D vertically stacked patterns with multiple metal layers separated by dielectric layers. This vertical dimensionality allows the antenna to achieve wider bandwidth and improved radiation characteristics while maintaining a compact footprint area.
2Loss of energy
If the number of metal layers in the patch pattern is increased to improve radiation efficiency, then the radiation properties are enhanced, but the manufacturing complexity increases
Solution Approach 1:
The patent combines multiple metal layers into integrated patch and coupling patterns formed through a unified plating process. The ground pattern, patch pattern, and coupling pattern are simultaneously formed in the same manufacturing step, reducing the number of separate fabrication processes while achieving complex multi-layer radiation structures.
3Manufacturing precision
If a plating process is used to form patterns with multiple metal layers, then the manufacturing precision is improved, but the process complexity increases
Solution Approach 1:
The patent forms a ground pattern on the lower surface of the lower dielectric layer before assembling the upper antenna unit. This preliminary grounding layer facilitates subsequent plating processes and provides a reference plane for precise pattern formation, improving manufacturing precision while streamlining the overall process.
4Adaptability or versatility
If the antenna is designed for wideband operation, then the frequency bandwidth is increased, but the antenna size increases
Solution Approach 1:
The patent achieves wideband operation by stacking multiple metal layers vertically with dielectric spacers, creating a three-dimensional radiation structure. This vertical arrangement provides multiple resonant modes and impedance matching opportunities within a compact footprint, enabling wide frequency bandwidth without increasing the planar area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the antenna's efficiency, handleability, and processability, enabling effective wideband operation and reduced size, while improving radiation properties and design rules for fine circuit implementation.
Implementation Method 1
an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer
Implementation Method 2
forming a patch pattern and a coupling pattern on the body by a plating process
Data Source
AI summary
A antenna may include a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer; a patch pattern disposed on the second surface and embedded in the adhesive layer; and a coupling pattern disposed on the fourth surface and having at least a portion overlapping the patch pattern on a plane. Each of the first dielectric layer and the second dielectric layer may include an organic binder and an inorganic filler.