Dielectric Armor Profile for Fiber Optic Assemblies
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Solution Overview
Problem
Conventional metallic interlocking armor in fiber optic cables requires grounding, making installation complex and expensive, and lacks robust mechanical properties without causing optical attenuation, while dielectric armor solutions have not yet provided a commercial alternative with desired features and recognition as armored cables.
Innovation Solution
The development of armored fiber optic assemblies with a dielectric armor that mimics the appearance and mechanical properties of metallic armor, including crush and impact resistance, without the need for grounding, using a spiral dielectric armor profile formed from layers of rigid and non-rigid materials to meet flame, smoke, and mechanical requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metallic interlocking armor is used to provide robust mechanical protection, then crush performance and mechanical strength are improved, but grounding requirements increase device complexity and installation cost
Solution Approach 1:
The patent replaces the metallic armor system with a dielectric armor system that provides equivalent mechanical protection through a layered structure of rigid and non-rigid materials, eliminating the need for grounding while maintaining crush performance
Solution Approach 2:
The patent uses a composite armor structure consisting of an inner rigid dielectric layer for crush resistance and an outer non-rigid dielectric layer for flexibility and environmental protection, achieving mechanical strength without metallic properties
2Strength
If metallic interlocking armor is used to provide robust construction, then mechanical strength is improved, but installation time and cost increase due to grounding procedures
Solution Approach 1:
The dielectric armor system replaces metallic armor, eliminating grounding requirements and associated installation procedures, thereby reducing installation time and cost while maintaining mechanical strength
3Device complexity
If conventional dielectric armor with smooth outer surface is used, then grounding is eliminated, but the cable is not easily recognized as armored by the craft
Solution Approach 1:
The outer non-rigid dielectric layer is provided in different colors to enable easy identification of the armored cable by the craft, replacing the visual identification function previously provided by metallic armor
Solution Approach 2:
The armor profile is formed only in the inner rigid dielectric layer, providing mechanical protection while allowing the outer layer to serve identification and environmental protection functions
4Device complexity
If dielectric armor is used to eliminate grounding requirements, then device complexity is reduced, but mechanical properties may be compromised
Solution Approach 1:
The dual-layer dielectric armor structure with rigid inner layer and non-rigid outer layer provides equivalent mechanical protection to metallic armor while maintaining flexibility and eliminating grounding requirements
Data Source
AI summary
Armor, configured for use with a fiber optic assembly, includes a dielectric tube having an armor profile and a length, where the dielectric tube has at least one layer formed from a rigid material. The armor profile is undulating along the length, and the armor profile has a band thickness and a web thickness. The band thickness is between about 0.5 millimeters and about five millimeters. The web thickness is less than the band thickness, and the web thickness is greater than or equal to 0.1 times the band thickness.