Homogeneous Dielectric Bond Ply for High-Speed Circuits
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Solution Overview
Problem
Current bond plies used in circuit laminates and multilayer circuits face challenges such as non-homogeneity, high dielectric constant, high dissipation factor, and mechanical property disparities, which lead to reliability issues and poor electrical performance, especially in dense and high-speed applications, where glass fabric-based and film-based bond plies fail to provide the necessary uniformity and hard stop during lamination.
Innovation Solution
A three-layer bond ply structure comprising an intermediate layer with a higher degree of cure sandwiched between two outer layers, all made of the same thermosetting composition and filler, but with different filler content, providing a homogeneous dielectric material with improved electrical and mechanical properties and acting as a hard stop during lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass fabric is used in bond plies, then mechanical strength is improved, but dielectric uniformity deteriorates due to higher dielectric constant and dissipation factor
Solution Approach 1:
The invention removes glass fabric from the bond ply structure entirely, extracting the problematic component that caused dielectric non-uniformity. The bond ply is reformulated as a homogeneous polymer composition without glass reinforcement, eliminating the interface between glass fibers and polymer that caused conductive anodic filament growth and dielectric property variations.
Solution Approach 2:
The invention uses a composite polymer-filler system where inorganic fillers (such as silica) are dispersed within a polymer matrix to provide mechanical strength without the dielectric problems of glass fabric. This composite approach maintains structural integrity while achieving homogeneous dielectric properties throughout the bond ply.
2Strength
If glass fabric is used in bond plies, then structural support is improved, but manufacturing complexity increases due to hole forming and plating issues
Solution Approach 1:
The invention removes glass fabric from the bond ply structure entirely, extracting the problematic component that caused dielectric non-uniformity. The bond ply is reformulated as a homogeneous polymer composition without glass reinforcement, eliminating the interface between glass fibers and polymer that caused conductive anodic filament growth and dielectric property variations.
Solution Approach 2:
The invention uses a composite polymer-filler system where inorganic fillers (such as silica) are dispersed within a polymer matrix to provide mechanical strength without the dielectric problems of glass fabric. This composite approach maintains structural integrity while achieving homogeneous dielectric properties throughout the bond ply.
3Reliability
If thin bond plies are made with glass fabric, then electrical performance is improved, but manufacturing difficulty increases significantly
Solution Approach 1:
The invention changes the fundamental parameters of the bond ply by eliminating glass fabric and using a homogeneous polymer composition with controlled filler content. This allows the bond ply to be made thinner while maintaining manufacturability, as the homogeneous structure can be more easily processed and laminated at reduced thicknesses without the fabrication issues associated with thin glass fabrics.
4Reliability
If homogeneous dielectric material is used, then electrical performance is improved, but mechanical strength may deteriorate without glass fibers
Solution Approach 1:
The invention uses a composite polymer-filler system where inorganic fillers (such as silica) are dispersed within a polymer matrix to provide mechanical strength without the dielectric problems of glass fabric. This composite approach maintains structural integrity while achieving homogeneous dielectric properties throughout the bond ply.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a homogeneous dielectric material with uniform electrical and mechanical properties, preventing overflow and ensuring accurate conductor layer spacing, thus enhancing the reliability and performance of dense, high-speed circuits by eliminating the need for glass fibers and providing a thinner, more efficient bond ply.
Implementation Method 1
the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and second outer layers
Data Source
AI summary
A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.