Inorganic Dielectric Bonding for Uniform-Temperature ESC Assemblies

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Solution Overview

Problem

Existing substrate processing technologies face challenges in achieving uniform temperature control and stability due to non-homogeneous construction of electrostatic chucks (ESCs), leading to local hot and cold spots and non-uniform processing results, particularly during high-temperature processes.

Innovation Solution

The use of inorganic dielectric bonding to combine ESC and heater plates made from dielectric materials like ceramic or glass, with electrodes embedded within, allows for precise temperature control and electrical insulation, while withstanding high temperatures and plasma erosion, using materials with matched thermal expansion coefficients to prevent deformations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electrostatic chucks are used for substrate holding, then substrate can be held securely during processing, but non-uniform temperature distribution occurs leading to local hot and cold spots

Engineering Contradiction:

Improvesubstrate holding stabilityVSAvoidtemperature uniformity

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The electrostatic chuck is divided into multiple independent heating zones with separate temperature control, allowing each zone to be optimized independently to eliminate hot and cold spots while maintaining secure substrate holding

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The temperature distribution parameters are changed by implementing independent temperature control for different zones, transforming the uniform temperature approach into a multi-parameter temperature control system that eliminates thermal non-uniformity

Inventive Principle:

Principle #35Parameter changes

2Reliability

If inorganic dielectric bonding is used to combine plates, then electrical insulation and high temperature resistance are improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical insulation and plasma erosion resistanceVSAvoidfabrication process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple functional plates (ESC plate, heater plate, cooling plate) are merged into a single integrated structure through inorganic dielectric bonding, combining electrical insulation, heating, and cooling functions while withstanding high temperatures and plasma erosion

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The structure uses composite materials bonded together through inorganic dielectric bonding, combining the advantages of different materials (dielectric properties, thermal conductivity, mechanical strength) to achieve reliable electrical insulation and plasma erosion resistance

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If materials with different thermal expansion coefficients are used in the chuck structure, then functional requirements are met, but thermal deformations occur at high temperatures

Engineering Contradiction:

Improvefunctional performanceVSAvoidstructural deformation

Core Design Contradiction:

Adaptability or versatilityVSShape

Solution Approach 1:

The design explicitly considers thermal expansion effects by selecting materials with matched thermal expansion coefficients or designing compensation mechanisms that prevent structural deformation during thermal cycling at high temperatures

Inventive Principle:

Principle #37Thermal expansion

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures uniform temperature control and stable substrate holding, preventing damage and non-uniform processing, even at high temperatures, by providing electrical insulation and resistance to plasma erosion.

Implementation Method 1

an inorganic dielectric bond including an inorganic dielectric material disposed between the first plate and the second plate

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

An electrostatic chuck (ESC) is a device that can generate electrostatic force to securely hold a substrate (e.g., wafer) in place against a puck

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 3

a cooling plate coupled to the substrate support, the cooling plate including a set of cooling channels

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 4

withstanding high temperatures and plasma erosion

Methodology Applied

Scientific EffectPlasma erosion resistance: Plasma

Data Source

PatentUS12400896B2Fabrication of substrate support devices using inorganic dielectric bonding

Publication Date: 2025.08.26 APPLIED MATERIALS INC

AI summary

A device includes a first plate including a first dielectric material and having a first set of electrodes embedded therein, a second plate including a second dielectric material and having a second set of electrodes embedded therein, and an inorganic dielectric bond including an inorganic dielectric material disposed between the first plate and the second plate. The first plate and the second plate are disposed on a base structure.