Dielectric-Bonded Substrate Support for Uniform ESC Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing technologies face challenges in achieving uniform temperature control and stability due to non-homogeneous construction of electrostatic chucks (ESCs), leading to local hot and cold spots and non-uniform processing results.
Innovation Solution
The use of inorganic dielectric bonding to combine ESC and heater plates made from dielectric materials like ceramic or glass, with embedded electrodes, provides electrical insulation, high-temperature tolerance, and plasma erosion resistance, enabling precise temperature control and uniform heat distribution through multi-zone heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mechanical chucks are used to hold substrates, then physical force is required to secure the substrate, but this increases the risk of damage to the substrate
Solution Approach 1:
The patent replaces the mechanical chucking system with an electrostatic field-based holding system. Electrodes embedded in the substrate support generate electrostatic forces that securely hold the substrate without physical contact or mechanical pressure, thereby eliminating the risk of substrate damage associated with mechanical chucks while maintaining reliable substrate positioning
2Reliability
If electrostatic chucks with non-homogeneous construction are used, then substrate holding is achieved, but uniform temperature control is compromised leading to local hot and cold spots
Solution Approach 1:
The patent employs a homogeneous dielectric material construction for the substrate support, where the entire support structure is made from uniform dielectric material with consistent thermal and electrical properties. This homogeneity ensures uniform heat distribution and eliminates local hot and cold spots while maintaining stable electrostatic substrate holding, as the uniform material composition provides consistent thermal conductivity and dielectric strength throughout the structure
3Reliability
If inorganic dielectric bonding is used to construct the substrate support, then electrical insulation and high-temperature tolerance are improved, but the fabrication process becomes more complex
Solution Approach 1:
The patent utilizes inorganic dielectric bonding to create a composite structure where dielectric material layers are bonded together to form the substrate support. This composite construction provides superior electrical insulation and high-temperature tolerance compared to single-material structures. The inorganic dielectric bonding process, while requiring precise control, creates a robust multi-layer structure that integrates electrodes and dielectric materials with optimized performance characteristics for plasma processing environments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures stable and uniform substrate holding with precise temperature control, preventing damage and ensuring consistent processing results across the substrate surface.
Implementation Method 1
an inorganic dielectric bond between the first plate and the second plate
Implementation Method 2
An electrostatic chuck (ESC) is a device that can generate electrostatic force to securely hold a substrate (e.g., wafer) in place
Implementation Method 3
enabling precise temperature control and uniform heat distribution through multi-zone heating
Data Source
AI summary
A substrate support includes a first plate including a first dielectric material, a second plate including the first dielectric material or a second dielectric material, at least one set of electrodes embedded within at least one of the first plate or the second plate, and an inorganic dielectric bond between the first plate and the second plate.