High-Frequency Dielectric Bonding of Dissimilar Adherends
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Solution Overview
Problem
Existing methods for bonding adherends made of different materials using thermal adhesives often fail to achieve sufficient adhesion strength, particularly when the materials are not easily bondable.
Innovation Solution
A bonding method utilizing high-frequency dielectric heating adhesive sheets, where at least two sheets with different thermoplastic resins are used, with specific volume content ranges and change rate conditions to ensure effective bonding between adherends of different materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single thermal adhesive containing heat-generating material is used to bond adherends, then the bonding process can be simplified, but sufficient adhesion strength cannot be obtained when adherends are made of different materials
Solution Approach 1:
The invention divides the bonding system into multiple adhesive sheets (first adhesive sheet and second adhesive sheet), each containing different thermoplastic resins. This segmentation allows each sheet to be optimized for bonding to specific adherend materials, thereby achieving sufficient adhesion strength when bonding adherends made of different materials while maintaining process simplicity through the use of pre-configured multi-layer adhesive sheets
Solution Approach 2:
The invention uses composite adhesive sheets comprising multiple layers with different thermoplastic resins (first thermoplastic resin and second thermoplastic resin). Each layer is specifically designed to bond to different adherend materials, creating a composite material system that provides both strong adhesion to dissimilar materials and simplified bonding process through integrated multi-functional adhesive structure
2Strength
If adhesive sheets with different thermoplastic resins are used to bond adherends of different materials, then adhesion strength is improved, but the complexity of selecting and configuring adhesive sheets increases
Solution Approach 1:
The invention merges multiple adhesive sheets with different thermoplastic resins into a single integrated multi-layer adhesive sheet assembly. The first adhesive sheet containing first thermoplastic resin and the second adhesive sheet containing second thermoplastic resin are combined in a configured arrangement, reducing the complexity of selecting and configuring separate adhesive sheets while maintaining strong adhesion to different adherend materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves firm bonding between adherends made of different materials, reducing the likelihood of interfacial peeling and ensuring strong adhesion, even with materials that are not easily bondable.
Implementation Method 1
A bonding method utilizing high-frequency dielectric heating adhesive sheets... applying a high-frequency wave to the first adhesive sheet and the second adhesive sheet... to thereby bond the first adherend and the first adhesive sheet together and bond the second adherend and the second adhesive sheet together
Data Source
AI summary
A bonding method using adhesive sheets respectively containing first and second thermoplastic resins. The volume content VA1 of the first thermoplastic resin in the adhesive sheet and the volume content VA2 of the second thermoplastic resin in the adhesive sheet are from 60 vol % to 100 vol %. Change rates Vx1 and Vx2 represented by formulae below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first adhesive layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second adhesive layer. The method includes applying a high-frequency wave to the adhesive sheets between adherends to bond them together,Vx1={(VA1−VB1)/VA1}×100 (Numerical Formula 1)Vx2={(VA2-VB2)/VA2}×100 (Numerical Formula 2).