Dielectric Bubble Ejection Holes for Precise Local Processing

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Solution Overview

Problem

Conventional bubble ejection technologies face issues such as breakage of narrow and thin ejection ports, damage to processing targets, complex production processes, and limitations in local ablation and injection due to heat generation and electrode arrangement restrictions.

Innovation Solution

A bubble ejection method and device using a dielectric substrate with penetrating bubble ejection holes, electrodes, and a novel voltage application mechanism to generate and eject bubbles from the substrate surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a narrow and thin bubble ejection port is used, then the bubble ejection precision is improved, but the port is prone to breakage

Engineering Contradiction:

Improvebubble ejection precisionVSAvoidport durability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The device is divided into a substrate portion and a bubble ejection port portion that can be separated. The bubble ejection port is formed as a protruding structure from the substrate, allowing it to be replaced or regenerated independently when damaged, while maintaining precise bubble ejection capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bubble ejection port is pre-formed as a robust protruding structure with sufficient mechanical strength before use. This preliminary structuring ensures both the precision needed for accurate bubble ejection and the durability to withstand operational stresses without breaking.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If a narrow and thin bubble ejection port is used, then the bubble ejection precision is improved, but the processing target is likely to be damaged

Engineering Contradiction:

Improvebubble ejection precisionVSAvoidtarget damage

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The bubble ejection port has different structural characteristics at different locations: the tip portion has a smaller diameter for precise bubble ejection, while the base portion has a larger diameter and greater thickness for mechanical strength. This gradient structure allows precise bubble ejection without concentrating excessive stress on the processing target.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The protruding structure of the bubble ejection port provides a mechanical buffer zone between the substrate and the processing target. This structure absorbs impact forces and prevents direct transmission of stress to the fragile processing target, cushioning against potential damage while maintaining ejection precision.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Adaptability or versatility

If semiconductor lithography technology is used to produce bubble ejection chip, then the production flexibility is improved, but the production process becomes complex

Engineering Contradiction:

Improveproduction flexibilityVSAvoidproduction process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention replaces complex semiconductor lithography processes with simpler mechanical or chemical etching methods to form the bubble ejection ports. This substitution maintains the ability to create precise protruding structures while significantly simplifying the production process and reducing manufacturing complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method and device provide a robust and efficient means of bubble ejection with reduced port breakage and improved usability, allowing for precise local processing without damaging the target and simplifying production.

Implementation Method 1

applying a voltage between a first electrode and a second electrode with a conductive liquid and the bubble ejection hole being in contact with each other, it is possible to eject a bubble from the bubble ejection hole into the conductive liquid

Methodology Applied

Scientific EffectElectrical breakdown: Avalanche Breakdown

Data Source

PatentUS12559773B2Bubble ejection method, bubble ejecting device, and bubble ejection apparatus

Publication Date: 2026.02.24 KYUSHU UNIV

AI summary

The present invention addresses the problem of providing a bubble ejection method based on a new principle that is different from conventional bubble ejection methods and a bubble ejecting device.To solve the problem, provided is a bubble ejection method using a bubble ejecting device, wherein the bubble ejecting device comprisesa substrate formed of a dielectric,at least one bubble ejection hole formed so as to penetrate through a first face and a second face, which is a face opposite to the first face, of the substrate,a first opening formed at a position of the first face at which the bubble ejection hole penetrates, anda second opening formed at a position of the second face at which the bubble ejection hole penetrates,the bubble ejection method comprising:a substrate-conductive liquid contact step;a conductive liquid-electrode contact step;a voltage application step; anda bubble ejection step.