Dielectric Cap Above Floating Gate Reduces Leakage Current

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Solution Overview

Problem

Non-volatile memory devices face challenges in reducing leakage current due to strong electric fields in the inter-poly dielectric region, particularly at the corners of the floating gate and control gate, which increases as feature sizes decrease, and existing high dielectric constant materials suffer from oxygen diffusion and electrical defects.

Innovation Solution

A dielectric cap is formed above the floating gate, reducing the electric field strength at the top of the floating gate and inhibiting leakage current by implanting oxygen and heating the floating gate to create a dielectric cap from the implanted oxygen and silicon, while maintaining sufficient capacitive coupling between the floating gate and control gate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the inter-poly dielectric thickness is reduced to increase capacitive coupling, then the coupling ratio is improved, but the leakage current increases due to stronger electric fields

Engineering Contradiction:
Improvecapacitive couplingVSAvoidleakage current
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The inter-poly dielectric layer is segmented into two distinct parts: a thin region that maintains strong capacitive coupling between control gate and floating gate, and a thick region that provides electrical isolation to prevent leakage current. This segmentation allows each region to optimize its function independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different thicknesses of the inter-poly dielectric are applied to different spatial locations: a first thickness in the coupling region for high capacitance and a second thickness in the isolation region for low leakage. This local quality variation resolves the contradiction by making the dielectric thickness position-dependent rather than uniform.

Inventive Principle:
Principle #3Local quality

2Reliability

If high dielectric constant materials are used to increase capacitive coupling, then the coupling ratio is improved, but oxygen diffusion and electrical defects increase

Engineering Contradiction:
Improvecapacitive couplingVSAvoidoxygen diffusion and electrical defects
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

Instead of changing the dielectric material's intrinsic properties (dielectric constant), the invention changes the geometric parameter (thickness) of the dielectric layer to achieve the desired capacitive coupling. This avoids the harmful effects associated with high-K materials while still improving coupling ratio.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dielectric cap effectively reduces leakage current without significantly impacting capacitive coupling, thereby addressing the challenge of increasing electric field strengths in smaller memory cell structures and minimizing defects associated with high dielectric constant materials.

Implementation Method 1

forming a dielectric cap above the floating gate... by implanting oxygen and heating the floating gate to create a dielectric cap from the implanted oxygen and silicon

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

reducing the electric field strength at the top of the floating gate and inhibiting leakage current

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 3

capacitive coupling between the control gate and floating gate... The threshold voltage of the memory cell is controlled by the amount of charge that is retained on the floating gate

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS7919809B2Dielectric layer above floating gate for reducing leakage current
Publication Date: 2011.04.05 SANDISK TECHNOLOGIES LLC
  • US7919809B2 patent drawing
  • US7919809B2 patent drawing
  • US7919809B2 patent drawing

AI summary

A memory system is disclosed that includes a set of non-volatile storage elements. A given memory cell has a dielectric cap above the floating gate. In one embodiment, the dielectric cap resides between the floating gate and a conformal IPD layer. The dielectric cap reduces the leakage current between the floating gate and a control gate. The dielectric cap achieves this reduction by reducing the strength of the electric field at the top of the floating gate, which is where the electric field would be strongest without the dielectric cap for a floating gate having a narrow stem.