Dielectric Carrier Segmentation for Power Module Insulation and Cooling
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Solution Overview
Problem
Power electronic modules face challenges in heat dissipation and electrical insulation, particularly at high voltages, where increasing thermal conductivity compromises electrical insulation and vice versa, and existing solutions either complicate or cost too much.
Innovation Solution
A power electronic module with a dielectric carrier comprising a fixed and a movable layer of similar dielectric permittivity and conductivity, allowing for uniform electric field distribution and improved insulation without compromising heat dissipation, where the movable layer enhances both insulation and cooling functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the carrier substrate is increased to improve electrical insulation, then the insulation performance is improved, but the heat dissipation capacity decreases
Solution Approach 1:
The patent divides the carrier substrate into two separate layers: a first carrier substrate for heat dissipation and a second carrier substrate for electrical insulation. This segmentation allows each layer to be optimized for its specific function without compromise - the first substrate can be thin for efficient heat transfer, while the second substrate provides the necessary insulation thickness.
Solution Approach 2:
The patent employs a composite structure combining two different ceramic materials with distinct properties. The first carrier substrate uses a material optimized for thermal conductivity, while the second carrier substrate uses a material optimized for electrical insulation. This composite approach enables simultaneous achievement of both heat dissipation and insulation requirements.
2Temperature
If materials with higher thermal conductivity are used for heat dissipation, then the heat dissipation capacity is improved, but the electrical insulation performance deteriorates
Solution Approach 1:
The patent separates the heat dissipation function and electrical insulation function into two distinct carrier substrate layers. The first carrier substrate is designed with materials and properties optimized for thermal management, while the second carrier substrate is designed with materials and properties optimized for electrical insulation, eliminating the need to compromise between these conflicting requirements in a single material.
Solution Approach 2:
The patent uses a composite structure of two different ceramic materials, each selected for its specific properties. The first carrier substrate material is chosen for high thermal conductivity to maximize heat dissipation, while the second carrier substrate material is chosen for superior electrical insulation properties. This composite material approach resolves the contradiction by allowing each material to excel at its designated function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat dissipation and electrical insulation without increasing module thickness, maintaining performance across harsh conditions while reducing complexity and cost.
Implementation Method 1
the fixed layer and the movable layer exhibiting similar dielectric permittivities and being superposed along at least one surface facing the at least one connection conductor
Implementation Method 2
The ceramic additionally makes contact with a cooling device such that the heat to be dissipated is diffused through the ceramic until reaching the cooling device, which dissipates the received heat into a heat transfer fluid
Data Source
AI summary
A power electronic module (1) including at least one semiconductor (5) that is connected to connection conductors (6, 7), and including a dielectric carrier (10) having both a fixed layer (9), on which at least one of said connection conductors (6) is mounted, and a movable layer (11), the fixed layer (9) and the movable layer (11) exhibiting similar dielectric permittivities and being superposed along at least one surface facing the at least one connection conductor (6).