Photoimageable Dielectric Carrier for Self-Aligned Via Formation
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Solution Overview
Problem
There is a need for a component carrier with a structured photoimageable dielectric layer that can be manufactured in an easy and effective manner, particularly for forming vias and recesses without the inefficiencies of existing methods like laser ablation or mechanical cutting.
Innovation Solution
The use of a structured conductive layer as a mask for photoimaging a photoimageable dielectric layer, allowing for efficient etching to form recesses and vias, which can be aligned with the conductive layer openings, enabling parallelization of the process and reducing costs by a factor of 2 to 13 compared to traditional methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional methods like laser ablation or mechanical cutting are used to form vias and recesses in dielectric layers, then manufacturing precision can be achieved, but productivity is low and process costs are high
Solution Approach 1:
The patent replaces mechanical cutting methods with a photochemical etching process. A photoimageable dielectric layer is exposed to electromagnetic radiation through a mask layer with openings, causing selective chemical changes that enable etching of vias and recesses. This substitution of mechanical processes with photochemical processes significantly increases throughput while maintaining precision.
Solution Approach 2:
The patent changes the physical and chemical parameters of the dielectric layer by using a photoimageable material that undergoes chemical transformation when exposed to electromagnetic radiation. This parameter change enables the material to be selectively removed through etching, allowing parallel formation of multiple vias and recesses simultaneously, thereby increasing productivity.
2Manufacturing precision
If traditional methods are used for forming structured dielectric layers, then manufacturing precision is maintained, but process costs increase
Solution Approach 1:
The mask layer serves multiple functions: it defines the pattern for vias and recesses, ensures precise alignment with the conductive layer openings, and acts as a protective layer during the etching process. This multi-functionality reduces the need for separate alignment and protection steps, simplifying the manufacturing process and reducing costs.
Solution Approach 2:
The patent replaces costly and complex mechanical alignment and cutting systems with a photochemical process. The alignment is achieved through the mask layer design and photoexposure process, which are more cost-effective and easier to implement than precision mechanical systems.
3Productivity
If photoimageable dielectric layers are used with traditional masking methods, then productivity increases, but device complexity increases
Solution Approach 1:
The patent combines the mask layer with the conductive layer structure, where the mask layer is formed as part of the same layer stack. This integration reduces the number of separate components and simplifies the overall device structure, offsetting the complexity of the photoexposure system with the simplicity of the integrated layer design.
Solution Approach 2:
The mask layer is designed to be self-aligned with the conductive layer openings, eliminating the need for complex external alignment systems. The structure serves its own alignment function, reducing the complexity of the masking and exposure system while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the throughput and reduces process costs by allowing simultaneous formation of multiple recesses and vias with precise alignment, while also enabling the integration of electronic components and further conductive structures on the component carrier.
Implementation Method 1
The photoimageable dielectric layer structure has at least one recess extending vertically through the photoimageable dielectric layer structure up to the at least one metal layer structure of the component
Data Source
AI summary
A component carrier includes a layer stack having at least one component carrier material, a component at least partially embedded in the layer stack, where the component has at least one metal layer structure; and a photoimageable dielectric layer structure on the layer stack. The photoimageable dielectric layer structure has at least one recess extending vertically through the photoimageable dielectric layer structure up to the at least one metal layer structure of the component.