Dielectric Case Millimeter Wave Waveguide

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Solution Overview

Problem

Flex cables and connectors in electronic devices occupy valuable space, require manual assembly, and are sensitive to dirt, with high data transfer rates necessitating tight mechanical tolerances and expensive shielding.

Innovation Solution

A millimeter wave communication system using a dielectric case or chassis as a waveguide to guide radio signals between electronic components, eliminating the need for physical connectors and reducing real estate requirements, with antennas and waveguides integrated into the PCB to facilitate efficient data transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If flex cables and connectors are used to connect electronic parts, then data transfer can be achieved, but valuable real estate is occupied and manual assembly is required

Engineering Contradiction:
Improveassembly automationVSAvoidcable and connector structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces mechanical cable and connector systems with electromagnetic wave propagation through dielectric structures. Millimeter wave signals transmit data between ICs without physical contact, eliminating manual assembly requirements and reducing structural complexity while maintaining high data transfer capabilities

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention extracts and eliminates the cable and connector components from the system by using the device case itself as a waveguide. This removes the need for separate connection mechanisms, freeing up internal space and simplifying the overall device architecture

Inventive Principle:
Principle #2Taking out (Extraction)

2Area of stationary object

If connectors are used to connect electronic parts, then data transfer is enabled, but connectors occupy large amount of PCB real estate

Engineering Contradiction:
ImprovePCB real estateVSAvoiddata transfer capability
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The patent merges the waveguide function with the existing device case structure, eliminating the need for separate connector components on the PCB. The dielectric case serves dual purposes as both structural housing and signal transmission medium, maximizing PCB real estate utilization while maintaining data transfer capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention transitions from planar PCB connector layouts to three-dimensional waveguide propagation through the device case. This spatial reconfiguration allows data transfer without occupying valuable two-dimensional PCB surface area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If connectors are used to connect electronic parts, then data transfer is achieved, but connectors are sensitive to dirt and wear out when mated many times

Engineering Contradiction:
Improveconnector durabilityVSAvoiddirt sensitivity
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical connector mating operations with contactless electromagnetic wave transmission. Millimeter wave signals pass through the dielectric case without physical contact, eliminating wear and tear issues while maintaining reliable data transfer over extended periods

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The dielectric case serves as an intermediary medium for signal transmission between ICs. This intermediate waveguide structure protects the transmission path from direct exposure to environmental contaminants like dirt, significantly improving reliability compared to exposed connector interfaces

Inventive Principle:
Principle #24Intermediary (Mediator)

4Productivity

If cables with shielding are used to carry high data rates, then data transfer requirements are met, but tight mechanical tolerances and expensive shielding are required

Engineering Contradiction:
Improvedata transfer rateVSAvoidmanufacturing cost and complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent replaces complex shielded cable assemblies with simple dielectric waveguide structures. The device case itself guides millimeter wave signals, achieving high data transfer rates without requiring expensive shielding materials or tight mechanical tolerances in cable connections

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention uses the existing dielectric case structure as the waveguide medium, replacing expensive shielded cables with a readily available device component. This significantly reduces manufacturing costs while maintaining the necessary data transfer capabilities

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the need for manual assembly, conserves space, and supports high data rates with low signal loss and energy efficiency, as the electromagnetic field is constrained within the dielectric case, enhancing signal-to-noise ratio and reducing the number of internal cables.

Implementation Method 1

a first waveguide configured to guide the radiated millimeter wave signal to the dielectric case, wherein the millimeter wave signal is coupled into to the dielectric case

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS10938089B2Millimeter wave communication through device case
Publication Date: 2021.03.02 NXP BV
  • US10938089B2 patent drawing
  • US10938089B2 patent drawing
  • US10938089B2 patent drawing

AI summary

A device, including: a dielectric case or chassis; a first integrated circuit (IC) configured to produce a millimeter wave signal; a first IC antenna configured to receive the millimeter wave signal from the IC and radiate the millimeter wave signal; and a first waveguide configured to guide the radiated millimeter wave signal to the dielectric case, wherein the millimeter wave signal is coupled into to the dielectric case.