Recessed Dielectric Ceiling Plate for Uniform Plasma Distribution

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Solution Overview

Problem

Conventional plasma processing apparatuses face challenges in adjusting plasma distribution and scaling down due to the need for a gap between conductive members and dielectric windows, which leads to non-uniform plasma processing and particle generation, especially under low-pressure conditions.

Innovation Solution

A plasma processing apparatus with a dielectric ceiling plate featuring recesses for installing electromagnetic wave supply parts with flat antennas, allowing for controlled plasma distribution and reduced particle generation by localizing electromagnetic field distribution and suppressing microwave transmission in the horizontal direction through specific thickness and bank configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a gap is provided between conductive members and dielectric windows to prevent particle generation, then particle generation is suppressed, but plasma distribution uniformity deteriorates and device size increases

Engineering Contradiction:
Improveparticle generationVSAvoidplasma distribution uniformity
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent removes the gap between the dielectric window and conductive member by directly fitting the dielectric window into the opening of the conductive member. This extraction of the gap eliminates the source of particle generation while maintaining plasma distribution uniformity through the direct contact configuration.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies different structural configurations to different regions: the dielectric window is directly fitted into the opening (no gap region), while the conductive member maintains its continuous structure. This local quality differentiation allows particle suppression at the interface while preserving overall plasma uniformity.

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If a gap is provided between conductive members and dielectric windows, then particle generation is reduced, but device complexity and size increase

Engineering Contradiction:
Improveparticle generationVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the gap structure entirely, replacing it with a direct fit configuration where the dielectric window is inserted into the opening of the conductive member. This simplifies the overall device structure while achieving particle generation suppression.

Inventive Principle:
Principle #2Taking out (Extraction)

3Productivity

If microwaves are introduced through dielectric windows fitted into conductive members, then plasma processing is enabled, but horizontal microwave transmission causes non-uniform plasma distribution

Engineering Contradiction:
Improveplasma processing capabilityVSAvoidplasma distribution uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent creates localized electromagnetic field confinement by fitting the dielectric window directly into the conductive member opening. This local structural arrangement prevents horizontal microwave transmission and confines the electromagnetic field to the intended processing region, ensuring uniform plasma distribution while maintaining processing capability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient control of plasma distribution and prevents particle generation, allowing for more uniform plasma processing and device miniaturization by localizing electromagnetic fields and suppressing horizontal microwave transmission.

Implementation Method 1

suppressing microwave transmission in the horizontal direction through specific thickness and bank configurations

Methodology Applied
Scientific EffectElectromagnetic field localization: Waveguide

Implementation Method 2

introducing microwaves into the processing chamber through the dielectric windows

Methodology Applied
Scientific EffectMicrowave radiation: Microwave Radiation

Implementation Method 3

generates plasma from a processing gas using microwaves introduced into a processing chamber

Methodology Applied
Scientific EffectPlasma generation: Plasma

Implementation Method 4

supply electromagnetic waves into the processing chamber

Methodology Applied
Scientific EffectElectromagnetic energy conversion: Electromagnetic Induction

Data Source

PatentUS20250006461A1Plasma Processing Apparatus
Publication Date: 2025.01.02 TOKYO ELECTRON LTD
  • US20250006461A1 patent drawing
  • US20250006461A1 patent drawing
  • US20250006461A1 patent drawing

AI summary

A plasma processing apparatus is presented. The apparatus comprises: a processing chamber having an upper opening; a dielectric ceiling plate that partitions an inner space and an outer space of the processing chamber to close the opening, and has a plurality of recesses formed on a surface facing the outer space; and a plurality of electromagnetic wave supply parts respectively having flat antennas, respectively installed in the plurality of recesses, and configured to supply electromagnetic waves into the processing chamber. The antennas are disposed at bottom portions of the plurality of recesses.