Dielectric Ceramic Composition for Low-Temperature Firing
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Solution Overview
Problem
Existing dielectric ceramic compositions for electronic components face challenges in achieving high permittivity, low dielectric loss, high insulation resistance, and high AC breakdown voltage while maintaining good temperature characteristics, often requiring high firing temperatures and compromising on manufacturing cost or reliability due to the use of certain additives.
Innovation Solution
A dielectric ceramic composition with a specific compositional formula (Ba1-x-yCaxSry)m(Ti1-zZrz)O3, incorporating subcomponents like La, Ce, Pr, and Si, optimized within certain ratio ranges to achieve low-temperature firing, high permittivity, and improved temperature characteristics, along with high AC breakdown voltage and insulation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high permittivity and AC breakdown voltage are achieved using conventional dielectric ceramic compositions, then the firing temperature becomes excessively high (1400°C), but the patent aims to reduce firing temperature while maintaining these properties
Solution Approach 1:
The patent modifies the chemical composition parameters of the dielectric ceramic by incorporating specific ratios of Ba, Ca, Sr, Ti, and Zr elements, along with controlled amounts of Mn and Cu additives. This compositional parameter change enables the material to achieve high permittivity and AC breakdown voltage at lower firing temperatures (1200-1400°C) while maintaining reliable dielectric performance
Solution Approach 2:
The patent creates a composite dielectric ceramic system by combining multiple oxide components (BaTiO3, CaZrO3, SrTiO3) with controlled additive elements (Mn, Cu). This composite approach allows the material to exhibit enhanced dielectric properties and reduced firing temperature requirements compared to conventional single-phase ceramics
2Reliability
If Mn is used as an additive to achieve good permittivity and AC breakdown voltage, then the dielectric reliability is jeopardized due to reduction in reduced atmosphere during manufacturing
Solution Approach 1:
The patent introduces Cu as an intermediary additive that mediates between the Mn additive and the reduced atmosphere during manufacturing. The Cu element acts as a buffer that prevents excessive reduction effects while allowing Mn to contribute to dielectric properties, thereby maintaining reliability
Solution Approach 2:
The patent employs small, controlled amounts of Mn (0.1-2.0 wt%) as a sacrificial additive that can be consumed or transformed during the firing process without compromising overall reliability. This limited quantity of Mn provides beneficial dielectric effects while minimizing harmful reduction atmosphere effects
3Volume of moving object
If the dielectric ceramic is downsized to meet high performance electronic device requirements, then maintaining high permittivity becomes challenging, but the patent aims to maintain capacitance even when downsized
Solution Approach 1:
The patent optimizes the compositional parameters to achieve ultra-high permittivity (εr ≥ 10,000) through controlled ratios of Ba, Ca, Sr, Ti, and Zr elements. This parameter optimization allows the dielectric to maintain high capacitance values even in miniaturized component geometries where volume is severely constrained
Data Source
AI summary
A dielectric ceramic composition of the invention comprises a main component expressed in a compositional formula of (Ba1-x-yCaxSry)m(Ti1-zZrz)O3, a first subcomponent of at least one compound selected from La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and Y, a second subcomponent of at least one compound selected from Si and Ag.