Dielectric Ceramic Material with Multi-Phase Composite Structure
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Solution Overview
Problem
Dielectric ceramic materials with high reliability under high field strength and temperature conditions lack sufficient thermal shock resistance, leading to potential cracking in monolithic ceramic capacitors during reflow soldering processes, especially with reduced layer thicknesses.
Innovation Solution
A dielectric ceramic material with a composition including ABO3-based crystal grains, Mg—Ni—Ti-containing crystalline grains, and Ba—Si-containing crystalline grains, along with auxiliary components like rare-earth elements and transition metals, which enhances thermal shock resistance and reliability under high-temperature loading conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric ceramic material with high reliability under high field strength and temperature is used, then reliability is improved, but thermal shock resistance deteriorates
Solution Approach 1:
The patent applies composite materials by combining multiple crystalline phases (R-Ni-Ti-O-based crystalline complex oxide, Mg-Ni-Ti-containing crystalline grain, and Ba-Si-containing crystalline grain) within a single dielectric ceramic material. This composite structure allows the material to simultaneously achieve high reliability under high field strength and temperature conditions while improving thermal shock resistance through the synergistic effects of different phases with complementary properties
2Productivity
If layer thickness is reduced to increase capacity, then productivity is improved, but thermal shock resistance deteriorates
Solution Approach 1:
The composite crystalline structure with multiple phases provides enhanced mechanical strength and thermal shock resistance even at reduced layer thicknesses. The Mg-Ni-Ti-containing and Ba-Si-containing crystalline grains act as reinforcement phases that prevent crack propagation, enabling thin layers to maintain high capacity while resisting thermal shock during reflow soldering
Solution Approach 2:
The patent introduces secondary grains with specific compositions (Mg-Ni-Ti-containing and Ba-Si-containing crystalline grains) at particular locations within the dielectric ceramic layers. These locally optimized regions provide enhanced thermal shock resistance where needed most, particularly at grain boundaries and interfaces, allowing the overall layer thickness to be reduced without compromising durability
Data Source
AI summary
A dielectric ceramic material is composed of a perovskite compound represented by ABO3 as a main component. In the case where ABO3 is, for example, BaTiO3, the crystal grains include BaTiO3 crystal grains composed of the main component and, as secondary phases, Mg—Ni—Ti-containing crystalline grains composed of a crystalline oxide containing at least Mg, Ni, and Ti and Ba—Si-containing crystalline grains composed of a crystalline oxide containing at least Ba and Si.