Dielectric Coating Stack for Thermal Conductivity and Electrical Isolation
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Solution Overview
Problem
Existing dielectric coatings and adhesives do not effectively balance dielectric strength and thermal conductivity, particularly in applications requiring high thermal management and electrical insulation.
Innovation Solution
The development of coated substrates featuring a dielectric coating layer with a dielectric strength of at least 50 kV/mm and a thermal conductivity of at least 0.3 W/K·m, combined with an adhesive layer having a thermal conductivity of at least 0.7 W/K·m, optimized for use in systems requiring efficient thermal management and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric coatings are used to provide electrical insulation, then dielectric strength is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent employs composite material structures where a dielectric coating layer is combined with a thermally conductive adhesive layer. The dielectric coating provides electrical insulation with high dielectric strength (≥50 kV/mm), while the adhesive layer with high thermal conductivity (≥0.7 W/K·m) compensates for the thermal insulation effect, creating a composite system that achieves both electrical isolation and thermal management
Solution Approach 2:
The patent applies different material properties to different layers: the dielectric coating layer is optimized for electrical insulation properties, while the adhesive layer is optimized for thermal conductivity. This local differentiation of material qualities allows each layer to perform its specific function optimally without compromising the other
2Temperature
If thermally conductive adhesives are used to improve thermal management, then thermal conductivity is improved, but dielectric strength deteriorates
Solution Approach 1:
The patent creates a composite structure where the adhesive layer provides high thermal conductivity (≥0.7 W/K·m) for thermal management, while the overlying dielectric coating layer restores the dielectric strength (≥50 kV/mm). The composite system achieves properties that neither layer could achieve alone
3Temperature
If high thermal conductivity materials are used to reduce thermal resistance, then thermal management is improved, but electrical insulation deteriorates
Solution Approach 1:
The patent designs a composite thermal management system where the thermally conductive adhesive layer reduces thermal resistance (≤2.0° C./W) while the dielectric coating layer maintains electrical insulation. The layered composite structure enables simultaneous optimization of both thermal and electrical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves a thermal resistance of no more than 2.0° C./W, effectively addressing the need for high thermal management while maintaining adequate electrical insulation, thereby enhancing the performance of coated substrates in various applications.
Implementation Method 1
the coating layer is deposited from a powder coating composition
Implementation Method 2
an adhesive is formed on at least a portion of the coating layer, wherein the adhesive is formed from an adhesive composition
Data Source
AI summary
Disclosed herein are coated substrates comprising a coating layer and an adhesive formed on at least a portion of the coating layer. The coating layer may be deposited from a powder coating composition and comprises a dielectric strength of at least 50 kV/mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) and a thermal conductivity of at least 0.3 W/K·m measured according to ASTM D5470 (steady-state methods). The adhesive may be formed from an adhesive composition and comprises a thermal conductivity of at least 1.0 W/K·m measured according to ASTM D5470. Also disclosed herein are systems for coating substrates. Also disclosed are methods of coating a substrate.