Dielectric-Layer Component Carrier for Compact Embedded Contacts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers pose challenges in efficiently embedding components while maintaining mechanical robustness and electrical reliability, particularly in managing heat dissipation and reducing the number of manufacturing steps.
Innovation Solution
A component carrier with a dielectric layer pre-applied to the component before embedding, which serves as a thermal conductor and electrical insulator, allowing for precise adjustment of the component's position and simplified manufacturing by eliminating the need for additional lamination steps, and enabling efficient heat removal through thermally conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a component is embedded in a component carrier without a pre-applied dielectric layer, then the manufacturing process requires additional lamination steps and the component carrier thickness increases, but the component can be properly electrically contacted
Solution Approach 1:
The dielectric layer is applied to the component surface before embedding the component in the component carrier. This preliminary action prepares the component for proper electrical contacting in advance, eliminating the need for additional lamination steps after embedding and reducing manufacturing complexity
2Reliability
If the dielectric layer extends beyond the main surface of the component laterally, then the component is better protected, but the component carrier becomes less compact and the embedding height cannot be precisely adjusted
Solution Approach 1:
The dielectric layer is configured to cover only the surface of the component without extending significantly beyond the lateral ends of the component. The thickness of the dielectric layer is controlled to be greater than a predetermined threshold, providing sufficient protection locally where needed while maintaining the compactness of the overall component carrier structure
3Manufacturing precision
If multiple lamination procedures are used to manufacture the component carrier, then the component can be properly embedded and contacted, but the manufacturing time increases and the component carrier becomes thicker
Solution Approach 1:
The dielectric layer is applied to the component before embedding, performing the electrical contact preparation in advance. This allows the component to be properly embedded and contacted in fewer lamination steps, reducing manufacturing time and minimizing the total thickness of the component carrier
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, mechanically robust, and electrically reliable component carrier with improved heat management and reduced manufacturing complexity, allowing for precise positioning and efficient thermal conductivity.
Implementation Method 1
a surface of the component is covered with a dielectric layer being formed on the component already before embedding the component
Implementation Method 2
enabling efficient heat removal through thermally conductive materials
Data Source
Figure 1~6
Figure 7~12
Figure 13~17
AI summary
A component carrier (100) which comprises a stack (104) comprising at least one electrically insulating layer structure (106) and/or at least one electrically conductive layer structure (108), a component (102) having one or more pads (110) and at least one dielectric layer (112) on at least one main surface of the component (102), wherein the at least one dielectric layer (112) does not extend beyond the main surface in a lateral direction, wherein the dielectric layer (112) at least partially covers the one or more pads (110) of the component (102), and at least one electrically conductive contact (114) extending through at least one opening (116) in the dielectric layer (112) up to at least one of the one or more pads (110).