Dielectric-Layer Component Embedding for Thin, Heat-Managed Carriers
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers pose challenges in efficiently embedding components while maintaining mechanical robustness and electrical reliability, particularly in managing heat generated during operation.
Innovation Solution
A component carrier is designed with a dielectric layer on the component's surface that covers the pads without extending beyond the main surface, allowing for precise embedding and electrical connection through conductive contacts formed within the dielectric layer, which can be made of thermally conductive materials for enhanced heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are miniaturized and densely packed to increase functionality, then the number of components and contacts increases, but heat removal becomes increasingly difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by embedding components within the component carrier stack. This vertical integration allows heat to be conducted through multiple layers and removed via thermal vias and heat sinks in the z-direction, enabling effective heat removal despite increased component density.
Solution Approach 2:
The patent introduces thermal management intermediaries including thermally conductive adhesive layers between components and carrier, thermal vias as heat transfer pathways through insulating layers, and dedicated heat sink structures. These intermediary elements facilitate efficient heat transfer from dense component arrangements to external cooling mechanisms.
2Adaptability or versatility
If more components are embedded in the component carrier, then functionality increases, but mechanical robustness and electrical reliability become harder to maintain
Solution Approach 1:
The patent segments the component carrier into functionally distinct layers: electrically conductive layers for signal transmission, electrically insulating layers for electrical isolation, and structurally supportive layers for mechanical strength. This segmentation allows each layer to be optimized independently, maintaining reliability while accommodating multiple embedded components.
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions and layers of the component carrier. Conductive pathways are provided where electrical connection is needed, while insulating materials are used in regions requiring electrical isolation. This localized optimization ensures reliable electrical connections without compromising overall structural integrity.
3Reliability
If dielectric layer extends beyond main surface laterally, then coverage is improved, but manufacturing complexity and thickness increase
Solution Approach 1:
The dielectric layer is applied selectively to cover only the pad regions that require electrical connection or protection, rather than extending uniformly across the entire component surface. This localized application reduces material usage, simplifies manufacturing alignment, and decreases overall device thickness while maintaining adequate pad coverage for reliable connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces the component carrier's thickness, and effectively manages heat generation, ensuring reliable electrical connectivity and mechanical robustness under harsh conditions.
Implementation Method 1
at least one dielectric layer on at least one main surface of the component, wherein the at least one dielectric layer does not extend beyond the main surface in a lateral direction, wherein the dielectric layer at least partially covers the one or more pads of the component
Implementation Method 2
at least one electrically conductive contact extending through at least one opening in the dielectric layer up to at least one of the one or more pads
Implementation Method 3
which can be made of thermally conductive materials for enhanced heat management
Data Source
AI summary
A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.