Dielectric Composite for Multi-Layer Capacitor Miniaturization
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Solution Overview
Problem
Current multi-layer ceramic condensers face limitations in reducing thickness while maintaining high capacitance and reliability, especially at elevated temperatures, due to the inherent properties of existing dielectric materials.
Innovation Solution
A dielectric composite is formed by agglomerating first and second dielectric materials with different crystal structures and metal elements, such as Sr1-xBaxNb2O6 and Sr2(1-y)Ba2yNb2O7, which allows for control of Curie temperature and improved relative permittivity, resistivity, and reduced dielectric loss, even at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the dielectric layer is reduced to increase capacitance, then the capacitance increases, but the reliability deteriorates especially at elevated temperatures
Solution Approach 1:
The patent uses a composite dielectric material consisting of multiple ceramic phases (e.g., Pb(Zr,Ti)O3 and Pb1-xLaxZr1-yTiyO3) with different Curie temperatures. This composite structure allows the dielectric to maintain high relative permittivity while ensuring reliability at elevated temperatures by distributing the phase transition characteristics across multiple components, preventing catastrophic failure at a single temperature point.
Solution Approach 2:
The patent modifies the chemical composition parameters of the dielectric material by introducing lanthanum (La) doping and adjusting the Zr/Ti ratio. These parameter changes enable control over the Curie temperature and phase transition characteristics, allowing the thin dielectric layer to maintain stable electrical properties across a wide temperature range despite reduced thickness.
2Volume of moving object
If the thickness of the dielectric layer is reduced to miniaturize the device, then the device size decreases, but the dielectric loss increases
Solution Approach 1:
The composite dielectric structure with multiple ceramic phases having complementary loss characteristics allows the thin film to achieve low overall dielectric loss. The combination of materials with different relaxation mechanisms compensates for the increased loss that would normally occur at reduced thickness, enabling miniaturization without sacrificing energy efficiency.
Solution Approach 2:
The patent optimizes the local composition and crystal structure within the dielectric layer to minimize energy loss mechanisms. By controlling the phase distribution and grain structure at the micro-scale, the dielectric loss is reduced even though the overall device dimensions are minimized.
3Productivity
If the thickness of the dielectric layer is reduced to improve integration density, then the integration density increases, but the relative permittivity stability deteriorates
Solution Approach 1:
The multi-phase composite dielectric provides temperature-stable relative permittivity through the synergistic interaction of different ceramic phases. Each phase contributes to the overall dielectric response in a way that compensates for temperature-induced variations, maintaining stable capacitance values across wide temperature ranges even in thin-film configurations suitable for high-density integration.
Solution Approach 2:
The patent carefully adjusts compositional parameters (doping concentration, phase ratios) to optimize the temperature coefficient of capacitance. These parameter optimizations ensure that the relative permittivity remains stable across the operating temperature range, enabling reliable high-density integration without performance degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dielectric composite achieves enhanced relative permittivity and reduced dielectric loss, enabling the miniaturization and thinning of multi-layered capacitors and electronic devices while maintaining performance across a wide temperature range.
Implementation Method 1
the first dielectric material has at least one first crystal structure, the second dielectric material has a second crystal structure that is different from the first crystal structure
Implementation Method 2
which allows for control of Curie temperature and improved relative permittivity, resistivity, and reduced dielectric loss, even at high temperatures
Data Source
AI summary
A dielectric composite includes: at least one first dielectric material represented by Chemical Formula 1, and at least one second dielectric material represented by Chemical Formula 2, wherein the first dielectric material has at least one first crystal structure and the second dielectric material has a second crystal structure that is different from the first crystal structure, and the first dielectric material and the second dielectric material are agglomerated with each other,A111-xA12xB12O6 Chemical Formula 1A212(1-y)A222yB22O7. Chemical Formula 2