Dielectric Composite Grain Boundary Insulation Layer
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Solution Overview
Problem
Conventional multi-layer ceramic capacitors face challenges in achieving smaller size, greater thinness, and higher capacity while maintaining high relative permittivity, as the thickness of the grain boundary insulation layer decreases, leading to reduced capacitance.
Innovation Solution
Incorporating a two-dimensional layered material with high relative permittivity, such as delaminated metal oxide nano sheets from aurivillius or Ruddlesden-Popper phases, into the grain boundary insulation layer, allowing for ultra-thin films with maintained or enhanced capacitance properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the grain boundary insulation layer is decreased to achieve smaller size and greater thinness, then the capacitor capacity is improved, but the relative permittivity is reduced
Solution Approach 1:
The patent applies composite materials by combining two-dimensional layered materials (such as transition metal dichalcogenides, hexagonal boron nitride, or graphitic carbon nitride) with conventional dielectric materials in the grain boundary insulation layer. This composite structure enables the maintenance of high relative permittivity even when the overall layer thickness is reduced to several to several tens of nanometers, thereby resolving the contradiction between miniaturization and permittivity preservation
Solution Approach 2:
The patent changes the material parameters by introducing two-dimensional layered materials with inherently high relative permittivity values into the grain boundary insulation layer. This parameter change allows the layer to achieve both ultra-thin dimensions (several to tens of nanometers) and high relative permittivity simultaneously, overcoming the conventional trade-off where thinner layers exhibit reduced permittivity
2Length of stationary object
If the thickness of the grain boundary insulation layer is decreased to achieve greater thinness, then the capacitor can be made thinner, but the capacitance is reduced
Solution Approach 1:
By incorporating two-dimensional layered materials with high relative permittivity into the grain boundary insulation layer, the composite structure compensates for the reduced thickness. The high permittivity of the two-dimensional material maintains the capacitance value even when the film thickness is reduced to several to several tens of nanometers, enabling ultra-thin capacitors with preserved capacitance
Solution Approach 2:
The introduction of two-dimensional layered materials fundamentally changes the dielectric parameters of the grain boundary insulation layer. This material substitution enables the layer to achieve both ultra-thin dimensions (several to tens of nanometers) and high capacitance simultaneously, breaking the conventional inverse relationship between thickness and capacitance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dielectric composite achieves high relative permittivity even at nanometer thicknesses, enabling the creation of smaller, thinner capacitors with improved capacitance, overcoming limitations of conventional intergranular insulation type capacitors.
Implementation Method 1
The two-dimensional layered material may have a relative permittivity of greater than or equal to about 50 and less than or equal to about 1000
Data Source
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AI summary
A dielectric composite including a plurality of crystal grains including a semiconductor or conductive material, and a grain boundary insulation layer between the crystal grains, wherein the grain boundary insulation layer includes a two-dimensional layered material covering at least a portion of a surface of at least one of the crystal grains, and a multi-layered capacitor and an electronic device including the same.