Dielectric Composition for Multilayer Ceramic Capacitors
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Solution Overview
Problem
The challenge is to enhance the capacity, dielectric constant, and reliability of electronic components, particularly multilayer ceramic capacitors, while minimizing the thickness of the dielectric layer to achieve microminiaturization, as thinner layers lead to increased electrical field strength and defects in microstructure, deteriorating DC-bias properties and insulation resistance.
Innovation Solution
A dielectric composition comprising a base material powder of (Ca1-xSrx)(Zr1-yTiy)O3, with manganese oxide or carbonate, yttrium or dysprosium oxide, and silicon oxide or carbonate, optimized to improve microstructural densification and grain boundary fraction, allowing for higher reliability and dielectric constant, even at reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the dielectric layer is decreased to achieve microminiaturization, then the capacity and miniaturization are improved, but the strength of the electrical field applied to the dielectric layer becomes higher and DC-bias property deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the dielectric layer by incorporating specific amounts of Mn (0.5-5 mol%), Y or Dy (0.1-5 mol%), and Si (0.1-5 mol%) into the (Ca1-xSrx)(Zr1-yTiy)O3 base material. These compositional parameter changes enable the dielectric layer to maintain high DC-bias properties and reliability even at reduced thickness for microminiaturization applications
Solution Approach 2:
The patent creates a composite dielectric material system by combining the base material (Ca1-xSrx)(Zr1-yTiy)O3 with multiple dopant elements (Mn, Y/Dy, Si). This composite structure leverages the synergistic effects of different elements: Mn for microstructural densification, Y/Dy for grain boundary control and reliability enhancement, and Si for microstructural uniformity, thereby achieving both miniaturization and maintained DC-bias properties
2Volume of moving object
If the thickness of the dielectric layer is decreased to achieve microminiaturization, then the capacity is improved, but defects in microstructure occur and insulation resistance deteriorates
Solution Approach 1:
The patent optimizes the concentration parameters of dopant elements to control microstructural development. Specifically, Mn at 0.5-5 mol% promotes densification, while Y or Dy at 0.1-5 mol% controls grain boundary characteristics. These parameter adjustments prevent microstructural defects and maintain high insulation resistance even in ultra-thin dielectric layers
Solution Approach 2:
The patent applies local quality enhancement by specifically targeting grain boundary regions with Y or Dy dopants. These elements segregate to grain boundaries and improve the local microstructural quality, thereby enhancing overall insulation resistance and preventing defect formation in the thin dielectric layer
3Quantity of substance
If boosting is performed to increase capacity, then the capacity is improved, but the strength of electrical field becomes higher and reliability deteriorates
Solution Approach 1:
The patent employs a composite dielectric material comprising (Ca1-xSrx)(Zr1-yTiy)O3 base material enhanced with Mn, Y/Dy, and Si dopants. This composite structure provides synergistic effects that enable the material to withstand higher electrical fields during boosting operations while maintaining reliability, as each element contributes specific properties: Mn for densification, Y/Dy for grain boundary strength, and Si for microstructural uniformity
Solution Approach 2:
The patent modifies the chemical composition parameters of the dielectric material to achieve optimal performance under boosted conditions. The specific ranges of Mn (0.5-5 mol%), Y or Dy (0.1-5 mol%), and Si (0.1-5 mol%) are optimized to enhance the material's electrical field tolerance and reliability during high-capacity boosting operations
Data Source
AI summary
A dielectric composition includes: a base material powder including (Ca1-xSrx) (Zr1-yTiy)O3 (0<x≤0.7, 0<y≤0.03); a first subcomponent including at least one selected from the group of an oxide of manganese (Mn) and a carbonate of manganese (Mn); a second subcomponent including at least one selected from the group of an oxide of yttrium (Y) and a carbonate of yttrium (Y), where a content of the second subcomponent is within a range from 2 to 3 mol, based on 100 mol of the base material powder; and a third subcomponent including at least one selected from the group of an oxide of silicon (Si) and a carbonate of silicon (Si), and an electronic component uses the same.