Dielectric Composition With RE-Mg-Ti-O Grains for Thermal Shock Resistance
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Solution Overview
Problem
Conventional dielectric compositions used in electronic components are prone to cracking due to thermal shock during mounting processes like flow soldering, which compromises their reliability and performance.
Innovation Solution
A dielectric composition incorporating RE-Mg—Ti—O segregation grains, where the rare earth element, magnesium, titanium, and oxygen constitute 70% or more of the metal elements, and the Mg to (RE + Mg) ratio ranges from 0.1 to 0.3, is used to prevent cracking by mitigating excessive grain growth and providing thermal shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional dielectric composition is used for mounting electronic components, then manufacturing cost is reduced (flow soldering), but cracks are generated in the dielectric composition due to thermal shock
Solution Approach 1:
The patent applies composite materials by combining multiple phases in the dielectric composition: a main phase (BaTiO3-based), a secondary phase (CaZrTiO3-based), and a tertiary phase (RE-Mg-Ti-O segregation grains). This multi-phase composite structure provides both the dielectric performance needed for component function and the thermal shock resistance required to withstand flow soldering processes without cracking.
Solution Approach 2:
The patent applies local quality by creating RE-Mg-Ti-O segregation grains with specific local compositions at grain boundaries and within the matrix. These localized regions have different properties (higher thermal conductivity, different thermal expansion characteristics) than the bulk material, providing crack resistance and thermal shock tolerance at critical locations while maintaining overall dielectric performance.
2Reliability
If RE-Mg—Ti—O segregation grains are added to prevent cracking, then thermal shock resistance is improved, but device complexity increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition parameters of the RE-Mg-Ti-O segregation grains, specifically setting the Mg content ratio (Mg/(RE+Mg)) between 0.1 and 0.3 and ensuring RE+Mg+Ti constitutes 70-95 atom% of the segregation grains. These parameter specifications optimize the balance between thermal shock resistance and dielectric performance, achieving crack prevention without excessive complexity.
Solution Approach 2:
The patent applies local quality by creating RE-Mg-Ti-O segregation grains with specific local compositions at grain boundaries and within the matrix. These localized regions have different properties (higher thermal conductivity, different thermal expansion characteristics) than the bulk material, providing crack resistance and thermal shock tolerance at critical locations while maintaining overall dielectric performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inclusion of RE-Mg—Ti—O segregation grains effectively prevents or mitigates cracks in the dielectric composition due to thermal shock, while maintaining high relative permittivity and ensuring thermal conductivity, thus enhancing the reliability and performance of electronic components.
Implementation Method 1
the RE-Mg—Ti—O segregation grains prevent or mitigate excessive grain growth of the main phase grains
Implementation Method 2
even if cracks are generated in the dielectric composition, progression of the cracks are stopped when the cracks reach the RE-Mg—Ti—O segregation grains
Implementation Method 3
thermal conductivity between the main phase grains is readily ensured, and thermal conductivity of the dielectric composition as a whole is increased, which makes the dielectric composition thermal shock resistant
Implementation Method 4
cracks may be generated in a dielectric composition (dielectric ceramic) of the electronic component due to thermal shock or the like
Data Source
AI summary
A dielectric composition includes main phase grains and segregation grains. The segregation grains at least partly include RE-Mg—Ti—O segregation grains including “RE”, Mg, Ti, and O. “RE” includes a rare earth element. “RE”, Mg, and Ti in the RE-Mg—Ti—O segregation grains constitute 70 parts by mol or more in total out of 100 parts by mol of a total of metal elements in the RE-Mg—Ti—O segregation grains. A ratio of Mg to a total of “RE” and Mg in the RE-Mg—Ti—O segregation grains ranges from 0.1 to 0.3.