Dielectric Copolymer Materials for Electronic Packaging
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Solution Overview
Problem
Current dielectric materials used in electronic packaging face challenges such as high processing temperatures leading to warping, poor adhesion to metals, and a lack of favorable mechanical and thermal properties, particularly in matching the thermal expansion coefficients of silicon and copper substrates, which results in thermal stress and mechanical deformation issues.
Innovation Solution
A novel copolymer is developed from a polymerizable mixture comprising a maleimide compound with mesogenic groups and a bi- or multifunctional compound, allowing for the formation of a dielectric material with a low coefficient of thermal expansion, high mechanical flexibility, and photostructurability, suitable for passivation layers in electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional dielectric materials are used, then processing temperatures are high, but this causes warping and thermal stress due to CTE mismatch between silicon and copper substrates
Solution Approach 1:
The patent modifies the chemical composition and molecular structure of the dielectric material by incorporating specific polymer matrices and fillers, which fundamentally changes the material's thermal expansion characteristics and processing temperature requirements, enabling low-temperature curing while achieving desired thermal and mechanical properties
Solution Approach 2:
The patent employs composite dielectric materials consisting of polymer matrices combined with specific fillers and additives, creating a multi-component system that balances thermal expansion coefficients, reduces curing temperatures, and maintains mechanical integrity during processing
2Stress or pressure
If dielectric materials with matched CTE are used, then thermal stress is reduced, but adhesion to metals deteriorates
Solution Approach 1:
The patent applies different functional components at different scales within the dielectric material - bulk composition is optimized for CTE matching while surface chemistry is engineered for metal adhesion, creating local property variations that satisfy both requirements simultaneously
Solution Approach 2:
The patent introduces adhesion promoters and surface-active agents as intermediary components between the dielectric material and metal substrates, which chemically or physically bridge the interface to maintain strong adhesion while the bulk material maintains matched thermal expansion properties
3Adaptability or versatility
If high mechanical flexibility is achieved, then thermal stress compensation is improved, but structural stability deteriorates
Solution Approach 1:
The patent creates a dielectric material with dynamic mechanical properties that can adapt to thermal stress through controlled flexibility while maintaining overall structural integrity, allowing the material to deform elastically under stress and return to its original state without permanent damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copolymer reduces thermal stress and mechanical deformation, enabling cost-effective and reliable manufacturing of microelectronic devices with improved reliability and reduced waste, while maintaining excellent mechanical and thermal properties.
Implementation Method 1
thermally induced stress owing to the coefficient of thermal expansion (CTE) mismatch between silicon (3 ppm/K) and copper-dominated (16.5 ppm/K) substrate and package
Implementation Method 2
The copolymers are obtained from a polymerizable mixture comprising a first monomer and a second monomer, wherein the first monomer is one or more polymerizable maleimide compound having mesogenic groups
Implementation Method 3
the copolymers are photostructurable and particularly suitable for various applications in electronic packaging
Data Source
AI summary
A polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties, and excellent mechanical properties. The polymerizable mixture can be used in a method for forming copolymers and the copolymers can be used in an electronic device as dielectric material. The copolymers can also be used in a manufacturing method for preparing a packaged microelectronic structure and microelectronic devices comprising the packaged microelectronic structure.