Dielectric Cover Member for Plasma Processing Apparatus
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Solution Overview
Problem
In plasma treatment processes, the concentration of plasma at metallic holder frames rather than the object being treated degrades the performance of the treatment, as both the object and holder frame are exposed to plasma, leading to inefficient processing.
Innovation Solution
A plasma processing device with a dielectric cover member positioned above the holder frame to prevent plasma concentration on the holder frame, allowing the object to be exposed through a central opening while covering the holder frame, thus enhancing the plasma treatment performance and reducing thermal distortion of the adhesive sheet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a metallic holder frame is used to hold the object during plasma treatment, then the object can be easily loaded and handled, but plasma concentrates on the holder frame instead of the object, degrading treatment performance
Solution Approach 1:
A dielectric cover member is introduced as an intermediary between the plasma environment and the metallic holder frame. This cover member has high dielectric constant and is positioned to cover the holder frame while exposing the object, thereby redirecting plasma concentration from the metal frame to the object being treated.
Solution Approach 2:
The dielectric properties of the cover member are utilized to change the electrical parameters of the plasma environment. By introducing a material with high dielectric constant (εr≥3.0) at a specific position relative to the holder frame, the plasma density distribution is modified through electromagnetic field interaction, causing plasma to concentrate on the object rather than the metallic frame.
2Productivity
If the holder frame is exposed to plasma, then the object can be treated, but the adhesive sheet undergoes thermal distortion, making handling difficult
Solution Approach 1:
The dielectric cover member is positioned to provide selective coverage: it covers the adhesive sheet and holder frame areas where thermal protection is needed, while leaving the object surface exposed to plasma treatment. This localized quality differentiation allows simultaneous achievement of effective treatment and thermal protection.
Solution Approach 2:
The dielectric cover member acts as a thermal barrier intermediary between the plasma heat source and the adhesive sheet. By positioning this cover at a predetermined distance from the object surface, it intercepts thermal energy while allowing plasma treatment to proceed on the exposed object.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the plasma treatment performance by preventing plasma concentration on the holder frame, ensuring effective treatment of the object and reducing thermal distortion of the adhesive sheet for easier handling post-treatment.
Implementation Method 1
a cover member made of dielectric material... the holder frame that holds the adhesive sheet is covered with the dielectric cover member... prevents plasma generated in the vacuum chamber from concentrating at the holder frame
Implementation Method 2
plasma is generated in the vacuum chamber, by which the object on the stage undergoes plasma treatment
Data Source
AI summary
Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.