Dielectric Deposition Ring with Fins for PVD Arcing Prevention
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Solution Overview
Problem
Arcing defects occur in high-power physical vapor deposition processes due to warped substrates creating gaps between the substrate and the grounded substrate support, leading to metal deposition on the support and shorting issues.
Innovation Solution
A dielectric plate and dielectric deposition ring are used to cover the substrate support, with the dielectric plate supporting the substrate and the ring covering the outer ledge, preventing shorting and arcing by using a dielectric material that does not conduct electricity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a grounded substrate support is used for high-power PVD processes, then the substrate can be effectively supported and grounded, but arcing defects occur when warped substrates create gaps between the substrate and support
Solution Approach 1:
A dielectric plate is introduced as an intermediary component between the grounded substrate support and the substrate. This dielectric plate prevents direct electrical contact while maintaining mechanical support, thereby eliminating arcing defects caused by gaps between warped substrates and the grounded support.
Solution Approach 2:
The support system is segmented into separate functional components: the grounded substrate support, the dielectric plate, and the substrate. This segmentation allows the support to be grounded while the dielectric plate provides electrical isolation, preventing arcing while maintaining structural stability.
2Adaptability or versatility
If substrate edges create a gap between the substrate and grounded substrate support, then warped substrates can be accommodated, but metal deposition occurs on the substrate support and arcing is induced
Solution Approach 1:
The dielectric plate serves as a mediator that allows the substrate to be positioned with gaps (accommodating warping) while preventing metal deposition on the grounded support. The dielectric material blocks the path for deposited metal to reach the support, eliminating the harmful effect while preserving the adaptability.
3Device complexity
If no dielectric coverage is provided on the substrate support, then the structure remains simple, but arcing and metal deposition issues occur during high-power PVD processes
Solution Approach 1:
The support structure is segmented into the grounded support and the dielectric plate component. This segmentation adds minimal complexity while significantly improving process stability by preventing arcing and metal deposition on the support, making the added complexity worthwhile for maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents arcing and metal deposition on the substrate support, improving deposition uniformity and extending tool uptime by reducing the need for preventative maintenance.
Implementation Method 1
a dielectric plate having a lower surface configured to cover a support surface of the substrate support and an upper surface configured to support a substrate
Implementation Method 2
high-power physical vapor deposition (PVD) processes depositing metal on warped substrates
Data Source
AI summary
Methods and apparatus for processing a substrate are provided herein. In some embodiments, a process kit for a substrate support includes: a dielectric plate having a lower surface configured to cover a support surface of the substrate support and an upper surface configured to support a substrate; and a dielectric deposition ring surrounding the dielectric plate and configured to cover a portion of the substrate support disposed radially outward of the support surface.