Dielectric Elastomer Sensor Laminates Strain-Free Fabrication
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Solution Overview
Problem
The challenge lies in fabricating laminates for sensing devices, particularly dielectric elastomer devices, where dispersants used to provide conductivity can contaminate dielectric layers, leading to reduced dielectric effects and operational issues, and the fabrication of thin layers often results in defects like particulates, air bubbles, and weak bonding, compromising the structural integrity.
Innovation Solution
A method involving temporary affixation of layers to substrates for bonding, allowing inspection and release to prevent strain and contamination, using sacrificial layers for strain mitigation, and applying external pressure for robust bonding, ensuring minimal deformation and defect-free laminates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If dispersants are used to provide conductivity in one layer, then electrical conductivity is improved, but contamination of dielectric layers occurs leading to reduced dielectric effect
Solution Approach 1:
The fabrication process segments the laminate fabrication into separate stages: first forming the conductive layer with dispersants, then removing it from the substrate, and finally forming the dielectric layer. This temporal and spatial segmentation prevents contamination while maintaining electrical conductivity in the final device.
Solution Approach 2:
The substrate acts as an intermediary that enables the conductive layer to be formed and then easily removed without contaminating the subsequent dielectric layer. The substrate mediates between the need for conductivity and the need for dielectric purity by providing a temporary support that can be cleanly separated.
2Length of moving object
If layers are made as thin as possible, then flexibility and compliance are improved, but defects such as particulates, air bubbles, or weak bonding occur compromising structural integrity
Solution Approach 1:
The substrate provides preliminary support to thin layers during fabrication, preventing defects like air bubbles and weak bonding before the layers are finalized. This preliminary action enables the creation of thin, flexible layers while maintaining structural integrity through the substrate's support during the critical formation stage.
Solution Approach 2:
The invention utilizes flexible substrates that can accommodate thin layer fabrication while maintaining structural integrity. The substrate's flexibility allows it to conform to thin layers without creating stress concentrations that would lead to defects, enabling both thinness and reliability.
3Ease of manufacture
If layers are handled and bonded without substrate support, then processing simplicity is improved, but strain is introduced into layers during handling and bonding
Solution Approach 1:
The substrate serves as a mediator that simplifies handling and bonding operations while preventing strain in the layers. During bonding, the substrate provides a stable platform that distributes forces evenly, preventing localized strain. The intermediary role of the substrate is eliminated after bonding by selective removal, achieving both processing simplicity and layer stability.
Solution Approach 2:
The invention changes the physical state or properties of the substrate-layer interface to enable easy bonding without strain. By controlling the bonding parameters and substrate properties, the system allows for simple processing while maintaining layer integrity, then modifies the interface to enable substrate removal.
Data Source
AI summary
In one aspect the invention provides a laminated device of flexible and compliant layers of material, such as used to provide a dielectric elastomer sensor. A flexible and compliant layer of material is affixed to a substrate to avoid strain during processing is bonded to another layer of flexible and compliant material and released from the substrate to form a laminate. The layer of flexible and compliant material affixed to the substrate may be inspected prior to bonding.