Dielectric Component Metallization via Selective Electro-Plating

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Solution Overview

Problem

Existing methods for producing dielectric components, such as capacitors, are inefficient and require extensive manipulation and multiple processing steps to create electrically isolated metallized surfaces, leading to variability in product performance and tolerance.

Innovation Solution

A method involving electro-plating to apply a conductive surface to a dielectric material and then using an electro-chemical process to selectively remove portions of the conductive surface, creating electrically isolated conductive areas, allowing for the formation of capacitors with improved precision and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If masking and selective deposition are used to create metallized surfaces, then electrically isolated conductive areas are formed, but the process requires extensive manipulation and multiple processing steps

Engineering Contradiction:

Improveprecision of electrically isolated conductive areasVSAvoidcomplexity of manufacturing process

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Instead of selectively depositing conductive material on specific areas (conventional approach), the patent applies conductive material to the entire dielectric surface and then selectively removes portions. This inversion simplifies the process by eliminating masking steps and using a single deposition operation followed by selective removal through electrochemical etching or mechanical means.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent divides the conductive surface into distinct electrically isolated areas after complete deposition. By applying conductive material uniformly first and then segmenting it through selective removal, the process achieves the same result as selective deposition but with fewer process steps and less complexity.

Inventive Principle:

Principle #1Segmentation

2Reliability

If masking and selective deposition are used to create metallized surfaces, then electrically isolated conductive areas are formed, but the process involves extensive manipulation and multiple processing steps

Engineering Contradiction:

Improveconsistency of product performanceVSAvoidefficiency of manufacturing process

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent inverts the conventional sequence by depositing conductive material on the entire dielectric surface first, then selectively removing portions to create isolated conductive areas. This eliminates multiple deposition and masking steps, reducing process complexity and variability while maintaining reliability and improving productivity through a streamlined single-deposition process.

Inventive Principle:

Principle #13The other way round (Inversion)

3Manufacturing precision

If conventional masking and selective deposition methods are used, then dielectric components are manufactured, but variability in product performance and tolerance occurs

Engineering Contradiction:

Improvetolerance of dielectric componentsVSAvoidconsistency of product performance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

By applying conductive material to the entire dielectric surface and then selectively removing portions, the patent eliminates variability introduced by masking alignment and selective deposition processes. This inversion approach ensures uniform initial coverage followed by controlled removal, significantly improving tolerance and performance consistency.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of capacitors with tighter tolerances and more predictable performance, reducing variability in parametric values like capacitance, and enabling the fabrication of multi-element circuits on a single dielectric substrate.

Implementation Method 1

the conductive surface may be applied by electro-plating. For example, the electro-plating may be carried out by placing the dielectric material in an electrolyte, and electrically connecting the dielectric material to a voltage source in order to make the dielectric a cathode

Methodology Applied

Scientific EffectElectro-plating: Electroplating

Implementation Method 2

The coated dielectric may be electrically connected to a voltage source in order to make the coated dielectric an anode. The conductive surface from the coated dielectric is then permitted to deposit on the deposition object

Methodology Applied

Scientific EffectElectro-chemical deposition: Electrodeposition

Data Source

PatentUS7611617B2Method of manufacturing a dielectric component, and dielectric components manufactured by such a method

Publication Date: 2009.11.03 SPECTRUM CONTROL INC

AI summary

A method of forming a dielectric component, such as a capacitor is disclosed. In such a method, a conductive surface is applied to a dielectric to form a coated dielectric. Then a portion of the conductive surface is removed from the coated dielectric to form at least two electrically isolated conductive areas.