Dielectric Attachment for Embedded Circuit Boards
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Solution Overview
Problem
Existing methods for manufacturing PCBs with embedded electronic components face challenges in accuracy, efficiency, and cost due to excessive welding points and the need for adhesive materials, which hinder the integration of thick or thin film components and increase manufacturing costs.
Innovation Solution
A method involving the direct attachment of dielectric layers to a circuit board with pre-drilled through holes corresponding to electronic device electrodes, using an adhesive first dielectric layer to reduce material costs and enhance positioning accuracy, followed by lamination with additional dielectric and circuit layers to create a stable circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material or metal conductive paste is applied to electronic components to stick them onto a dielectric layer, then the electronic components can be attached to the PCB, but the manufacturing cost increases
Solution Approach 1:
The dielectric layer itself is made adhesive through material selection, allowing it to directly bond electronic components without requiring additional adhesive materials. The dielectric layer serves dual functions: electrical insulation and mechanical bonding, eliminating the need for separate adhesive applications and reducing manufacturing costs.
Solution Approach 2:
The dielectric layer is designed to perform multiple functions simultaneously: providing electrical insulation between conductive layers and providing adhesive bonding surfaces for electronic components. This multi-functionality eliminates the need for separate adhesive materials and reduces the number of manufacturing steps.
2Manufacturing precision
If through holes are produced before embedding electronic devices with pre-set positions, then positioning accuracy is improved, but the manufacturing process becomes more complex
Solution Approach 1:
Through holes are pre-formed in the dielectric layer at precise locations before electronic components are embedded. This preliminary action establishes accurate positioning references that guide component placement, ensuring high positioning accuracy while allowing subsequent embedding steps to proceed systematically.
Solution Approach 2:
The manufacturing process is divided into distinct sequential steps: first forming through holes at precise locations, then embedding electronic components into these pre-positioned holes. This segmentation allows each step to be optimized independently, maintaining high precision while managing overall process complexity.
3Area of stationary object
If electronic components are consolidated and embedded into PCB to reduce area occupation, then slim volume and versatility are improved, but the manufacturing accuracy and reliability become more challenging
Solution Approach 1:
Electronic components are embedded within the PCB structure by placing them into through holes formed in the dielectric layer. This nesting approach allows components to be integrated within the board thickness rather than adding to the planar area, achieving slim volume while maintaining manufacturing accuracy through precise hole formation and component placement.
Solution Approach 2:
Through holes are pre-formed at exact locations before component embedding, establishing precise positioning references. This preliminary action ensures that even as more components are embedded to reduce area occupation, each component can be accurately positioned, maintaining high manufacturing precision throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves accuracy and reduces manufacturing costs by eliminating the need for adhesive materials and metal conductive paste, while ensuring precise electrode alignment and enhanced fixing strength for embedded electronic devices.
Implementation Method 1
attaching a first dielectric layer to the copper clad laminate, wherein the first dielectric layer is adhesive
Implementation Method 2
laminating the third dielectric layer and the additional circuit layer on the electronic device and the circuit substrate
Data Source
AI summary
A method for directly attaching dielectric to a circuit board with embedded electronic devices is provided. That is, a plurality of through holes are produced before embedding an electronic device, wherein plural through holes are corresponding to a plurality of electrodes of the electronic device. So that the plural electrodes of the electronic device is accurately positioned with the through holes if the electronic device is being embedded. On the other hand, since the first dielectric layer is adhesive, the electronic device is directly stuck on the first dielectric layer in order to save cost of adhesive material or metal conductive paste in prior arts.