Dielectric Thin Film Element Close-Adhesion Layer Humidity Resistance
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Solution Overview
Problem
Dielectric thin film elements face deterioration in humidity resistance due to low close-adhesion properties between protective layers and substrates, leading to peeling and defects that allow water penetration, which can degrade their initial and long-term characteristics.
Innovation Solution
A dielectric thin film element with a close-adhesion layer between the substrate and protective layer, where the close-adhesion layer intervenes between the protective layer and substrate, and a metal film is applied to prevent water penetration, and the protective layer consists of both inorganic and organic layers with a multi-layer inorganic structure to reduce leakage current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating protective layer and metal thin film are laminated to shut out water penetration, then humidity resistance is improved, but close-adhesion property between the protective layer and substrate deteriorates
Solution Approach 1:
A close-adhesion layer is introduced as an intermediary between the substrate and the insulating protective layer. This intermediate layer specifically addresses the adhesion problem by providing a bonding interface that prevents peeling and void formation, while allowing the outer protective layers to maintain their water-blocking function.
Solution Approach 2:
The protective structure is designed as a composite multi-layer system consisting of the substrate, close-adhesion layer, insulating protective layer, and metal thin film. Each layer contributes different properties: the close-adhesion layer provides bonding strength, the insulating layer provides electrical isolation and environmental protection, and the metal film provides additional barrier properties.
2Object-affected harmful factors
If the insulating protective layer is applied to cover the capacitance section, then protection against water penetration is improved, but defects such as voids and peeling are generated due to poor adhesion
Solution Approach 1:
The close-adhesion layer serves as a mediator that ensures uniform and defect-free coverage of the protective layers. By providing a consistent bonding interface, it prevents the formation of voids and peeling defects that would otherwise occur at the substrate-protective layer interface.
Solution Approach 2:
The close-adhesion layer is formed on the substrate before applying the insulating protective layer and metal film. This preliminary action prepares the surface with optimal adhesion properties, ensuring that subsequent layers are deposited uniformly without forming defects.
3Volume of moving object
If scale reduction and thickness reduction are made in the capacitance section, then miniaturization is achieved, but characteristics of the capacitance section may be deteriorated by penetration of water
Solution Approach 1:
A composite multi-layer protective structure is applied over the miniaturized capacitance section. This composite structure, consisting of multiple materials with different properties (insulating material and metal film), provides enhanced water penetration resistance that protects the small-scale capacitance section from environmental degradation.
Solution Approach 2:
The protective layers are nested over the capacitance section in a concentric manner, with the close-adhesion layer at the bottom, followed by the insulating protective layer, and the metal thin film on the outer surface. This nested structure provides multiple barriers against water penetration while maintaining compact dimensions.
Data Source
AI summary
A dielectric thin film element that includes a substrate, a close-adhesion layer formed on one principal surface of the substrate, a capacitance section having a lower electrode layer formed on the close-adhesion layer, a dielectric layer formed on the lower electrode layer, and an upper electrode layer formed on the dielectric layer, and a protective layer formed to cover the capacitance section, wherein the end of the close-adhesion layer is exposed from the protective layer.