Dielectric Filter Via Hole Partition Ring Capacitive Coupling
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Solution Overview
Problem
Existing dielectric filters face challenges in precisely controlling the depth of blind slots or holes for capacitive coupling, leading to increased processing difficulty, especially in miniaturized high-frequency components where precision is critical.
Innovation Solution
A dielectric filter design featuring a dielectric block with resonant cavities, via holes, and conductive partition rings for capacitive coupling, which simplifies the processing and adjusts capacitive coupling strength by varying the interval between the partition ring and via hole edges, reducing the complexity of blind slot or hole processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If blind slots or blind holes are used for capacitive coupling, then capacitive coupling can be implemented, but processing precision control becomes difficult
Solution Approach 1:
The patent transitions from controlling depth in the vertical dimension (blind slots/holes) to controlling the horizontal dimension (distance between conductive partition layer and via hole wall). This dimensional shift simplifies manufacturing by using surface-level features rather than requiring precise deep-hole drilling and depth control.
Solution Approach 2:
The conductive partition layer acts as an intermediary element that enables capacitive coupling without requiring precise blind slot or blind hole processing. It serves as a mediator between the via hole and the resonant cavity, providing a reliable capacitive coupling mechanism through its position and geometry rather than through precise depth-controlled features.
2Volume of moving object
If miniaturized high-frequency components are used, then filter size is reduced, but processing precision requirements increase
Solution Approach 1:
By shifting the critical dimension from vertical depth control to horizontal positioning of the conductive partition layer relative to the via hole, the patent enables miniaturization without proportionally increasing precision requirements. The horizontal features can be more easily controlled in small-scale manufacturing.
Solution Approach 2:
The patent changes the critical geometric parameters from depth measurements to surface-level dimensional measurements (distance between conductive partition layer and via hole wall). This parameter transformation allows for easier fabrication and quality control in miniaturized components, as surface features are more readily manufacturable with high precision than deep, narrow features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design lowers processing difficulty and achieves high precision in capacitive coupling, effectively addressing the precision control issues in miniaturized high-frequency filters by using a combined structure of via holes and conductive partition layers.
Implementation Method 1
Capacitive coupling between resonant cavities is implemented through a combined structure of the via hole and a conductive partition layer
Implementation Method 2
the dielectric block includes at least two resonant cavities
Data Source
AI summary
Example dielectric filters, transceiver devices, and base stations are described. One example dielectric filter includes a dielectric block whose surface is covered with a metal layer, where the dielectric block includes at least two resonant cavities. The dielectric block is provided with a via hole, the via hole is located between two adjacent resonant cavities, and an inner wall of the via hole is covered with a metal layer. A first partition ring is disposed on the surface of the dielectric block and is surrounding at least one opening of the via hole, and the dielectric block is exposed in an area enclosed by an inner edge of the first partition ring and an outer edge of the first partition ring.