Dielectric Flange Blocks Plasma Field in Substrate Chamber
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Solution Overview
Problem
In substrate treating apparatuses, the gap between the inner sidewall of the process chamber and the liner can lead to damage from plasma, causing particle generation and increased drift distances, which results in substrate contamination.
Innovation Solution
A substrate treating apparatus is designed with a liner having a ring-shaped body and a flange extending from its outer sidewall, where the flange is made of a dielectric material or has a dielectric layer to prevent the electric field and process gas from entering the gap, thereby inhibiting particle generation and reducing drift distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a gap is formed between the inner sidewall of the process chamber and the liner due to machining tolerance, then the liner can be easily installed, but the electric field and process gas enter the gap causing plasma damage to the inner sidewall and particle generation
Solution Approach 1:
A dielectric flange is introduced as an intermediary component between the liner and the process chamber wall. The flange extends into the gap region and blocks the electric field and process gas from reaching the inner sidewall, thereby preventing plasma damage while maintaining the installation gap for ease of assembly
Solution Approach 2:
The dielectric flange acts as a sacrificial or replaceable component that protects the expensive process chamber inner sidewall. Instead of making the entire chamber structure complex or expensive to protect against plasma damage, a relatively simple dielectric flange is used that can be replaced if needed
2Reliability
If process gas is provided into the gap between the liner and inner sidewall, then the liner is protected from plasma, but particles drift longer distances and reach the substrate causing contamination
Solution Approach 1:
The dielectric flange serves as a physical barrier that interrupts the direct path of particles drifting from the gap region to the substrate. By blocking the electric field and confining the process gas, the flange reduces particle drift distance and prevents contamination while still allowing the liner to protect against plasma
3Object-affected harmful factors
If the liner is positioned close to the inner sidewall to prevent particle generation, then substrate contamination is reduced, but the liner may be damaged by plasma
Solution Approach 1:
The dielectric flange acts as a shield that protects the liner from direct plasma exposure. It blocks the electric field and process gas that would otherwise cause plasma formation and damage to the liner, allowing the liner to be positioned closer to the inner sidewall for better particle control while the flange absorbs the plasma damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the inner sidewall of the process chamber from plasma damage and reduces particle drift, preventing substrate contamination by blocking the electric field and process gas from entering the gap between the liner and the sidewall.
Implementation Method 1
a microwave applying unit applying a microwave to the antenna plate
Implementation Method 2
The plasma means an ionized gas state consisting of ions, electrons, and/or radicals
Implementation Method 3
a flange extending from an outer sidewall of the body into a wall portion of the process chamber... a surface of the flange may be formed of a dielectric material
Implementation Method 4
an etching process may be performed by colliding ion particles contained in the plasma with a substrate
Data Source
AI summary
The inventive concepts provide a substrate treating apparatus. The apparatus includes a process chamber, a substrate support unit, a gas supply unit, a microwave applying unit, an antenna plate, a slow-wave plate, a dielectric plate, and an exhaust baffle, and a liner. The liner includes a body having a ring shape facing an inner sidewall of the process chamber, and a flange extending from the body into a wall portion of the process chamber. The flange prevents an electric field of a microwave and a process gas from being provided into a gap between the process chamber and the body. Thus, it is possible to inhibit particles from being generated by damage of the inner sidewall of the process chamber by plasma, and drift distances of the particles can be reduced to inhibit the particles from reaching a substrate.