Dielectric Fluid Cooling for LED Thermal Management
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Solution Overview
Problem
Existing cooling methods for high-power and high-intensity LED lamps are insufficient, leading to local hotspots and increased costs, and fail to effectively manage heat in LED chips and phosphor layers, which reduces quantum efficiency and light intensity.
Innovation Solution
A liquid or gaseous dielectric cooling fluid system integrated with the LED lamp, utilizing natural convection and optionally a micro-or meso-size pump for forced convection, to efficiently transfer heat from the LED chip and phosphor to a heat sink, reducing thermal resistance and eliminating local hotspots, while being cost-effective and suitable for various LED colors and brightness levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passive heat sink cooling is used, then cooling capacity increases with surface area, but heat sink size and weight increase, exceeding standard limits
Solution Approach 1:
The patent introduces a liquid cooling system where a cooling liquid circulates through channels in the heat sink, enabling efficient heat transfer without requiring excessive surface area. The liquid medium absorbs heat from LED chips and phosphor layers, transporting it to heat dissipation regions, thus achieving effective cooling with compact dimensions that comply with size standards.
2Temperature
If active cooling with fans is used, then cooling efficiency improves for high power LEDs, but cost increases
Solution Approach 1:
The patent employs natural convection currents within the liquid cooling system to drive coolant circulation without requiring external fans or pumps. The temperature differential between heated and cooler regions of the cooling liquid creates buoyancy-driven flow, enabling passive heat removal that eliminates the need for additional active cooling components and reduces manufacturing costs.
3Loss of energy
If conventional cooling is used, then basic heat removal is achieved, but local hotspots in LED chips and phosphor layers persist, reducing quantum efficiency
Solution Approach 1:
The patent implements segmented cooling channels that directly contact or closely approach individual LED chips and phosphor layers, providing localized heat extraction at the source. This distributed cooling approach prevents heat accumulation in specific regions, maintaining optimal temperatures across all light-emitting elements and preserving quantum efficiency.
Solution Approach 2:
The cooling liquid serves as an intermediary medium that bridges the thermal gap between heat-generating components (LED chips and phosphor) and the heat sink structure. By circulating through channels in direct thermal contact with these components, the liquid efficiently transfers heat away before it can create detrimental hotspots, thereby maintaining high quantum efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces thermal resistance, increases light extraction efficiency, extends the lifespan of the LED source, and maintains efficient cooling without additional power consumption, addressing the limitations of existing cooling methods by providing superior heat management and cost-effectiveness.
Implementation Method 1
utilizing natural convection and optionally a micro-or meso-size pump for forced convection, to efficiently transfer heat from the LED chip and phosphor to a heat sink
Implementation Method 2
a dielectric cooling fluid (3) which directly contacts with LED chips (5)... moves towards the LED chips (5), and decreases the temperature of the LED chips (5) by contacting the LED chips (5) upon said movement
Data Source
AI summary
A lighting system has a dielectric cooling fluid which directly contacts with an LED chip; contacts with the heat sink base by moving towards the heat sink base, i.e. upwards, with the decreasing density as a result of the increased temperature due to the high temperature formed in the LED chip; at the same time the temperature thereof decreasing upon contacting with the heat sink base; moves towards the LED chip, and reduces the temperature of the LED chip by contacting the LED chip upon said movement; and movement channels through which the cooling fluid in gaseous or liquid phase passes during the movement of said cooling fluid.