Dielectric Grain Control in Multilayer Capacitors for Breakdown Voltage
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Solution Overview
Problem
The miniaturization of multilayer ceramic capacitors leads to increased electric fields per unit thickness, causing issues like temperature rise, effective capacitance change rate, and decreased breakdown voltage, which compromises reliability.
Innovation Solution
A dielectric composition with a BaTiO3-based main component and subcomponents BaCO3 and SiO2, where BaCO3 is 4.0 mole % or more and SiO2 is 7.0 mole % or more relative to 100 mole of Ti, inducing a uniform abnormal grain growth system, reducing dissipation factor, effective capacitance change rate, and increasing breakdown voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the thickness of the dielectric layer is reduced to achieve miniaturization and high capacitance, then the capacitance and miniaturization are improved, but the reliability decreases due to increased electric field per unit thickness, temperature rise, and decreased breakdown voltage
Solution Approach 1:
The patent changes the chemical composition parameters of the dielectric layer by adding specific amounts of BaCO3 (4.0-10.0 wt%) and SiO2 (5.0-15.0 wt%) to the BaTiO3-based ceramic composition. This parameter change modifies the grain growth characteristics and microstructure, enabling the thin dielectric layer to maintain high breakdown voltage and reliability while achieving miniaturization and high capacitance
Solution Approach 2:
The patent creates a composite dielectric material system by combining BaTiO3-based ceramic with BaCO3 and SiO2 additives. This composite composition produces a uniform abnormal grain growth system during sintering, resulting in a microstructure with 55% or more of dielectric grains in the 100-250 nm size range, which simultaneously achieves thin layer thickness, high capacitance, and improved reliability
2Productivity
If the thickness of the dielectric layer is reduced, then miniaturization is achieved, but the temperature rise increases due to increased electric field per unit thickness
Solution Approach 1:
The patent modifies the compositional parameters by incorporating BaCO3 and SiO2 in specific proportions, which changes the thermal and electrical properties of the dielectric layer. This parameter change reduces the temperature rise caused by high electric fields in thin layers, enabling miniaturization without excessive heating
Solution Approach 2:
The composite dielectric composition with BaTiO3, BaCO3, and SiO2 creates a microstructure that dissipates heat more effectively. The uniform abnormal grain growth system with controlled grain size distribution (55% or more of 100-250 nm grains) reduces dielectric loss and temperature rise, allowing miniaturized capacitors to operate reliably at higher electric fields
3Productivity
If the thickness of the dielectric layer is reduced, then high capacitance is achieved, but the effective capacitance change rate increases, decreasing reliability
Solution Approach 1:
The patent changes the chemical composition parameters by adding BaCO3 (4.0-10.0 wt%) and SiO2 (5.0-15.0 wt%) to stabilize the microstructure of the thin dielectric layer. This parameter change reduces the effective capacitance change rate by preventing excessive grain growth and maintaining uniform dielectric properties, thereby improving reliability while achieving high capacitance
Solution Approach 2:
The composite dielectric system with controlled BaCO3 and SiO2 content creates a uniform abnormal grain growth system that stabilizes the microstructure. This results in 55% or more of dielectric grains being in the 100-250 nm size range, which maintains consistent dielectric properties and reduces capacitance change rate, enabling high capacitance with improved reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of multilayer electronic components by securing a uniform microstructure, reducing dissipation factor, and improving withstand voltage characteristics while maintaining a high dielectric constant.
Implementation Method 1
inducing a uniform abnormal grain growth system
Data Source
AI summary
A multilayer electronic component according to some embodiments of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer.