Dielectric Heat Transfer Windows for Electrical Switching Devices

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Solution Overview

Problem

Electrical distribution assemblies face challenges in managing heat generated by switching devices, leading to excessive temperatures, structural weaknesses, and inefficiencies in heat transfer due to current thermally conductive materials, which can result in component damage and malfunctions.

Innovation Solution

Incorporating a thermally conductive ceramic element with a dielectric material, such as boron nitride or aluminum nitride, that acts as a heat transfer window to dissipate heat away from heat-generating components within the electrical distribution and switching devices, ensuring structural integrity and efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermally conductive materials (TIM, PPO, epoxy resin) are used to transfer heat from electrical switching devices, then heat transfer capability is improved, but structural integrity deteriorates under extreme conditions

Engineering Contradiction:
Improveheat transfer capabilityVSAvoidstructural integrity
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent employs aluminum nitride ceramic material that combines high thermal conductivity (200-500 W/(m·K)) with excellent mechanical strength and structural integrity. This composite material approach resolves the contradiction by providing both superior heat transfer capability and resistance to thermal shock, making it suitable for extreme conditions where conventional materials fail.

Inventive Principle:
Principle #40Composite materials

2Temperature

If highly thermally conductive TIM materials are used to eliminate air gaps and improve heat transfer, then thermal conductivity is improved, but cost increases prohibitively

Engineering Contradiction:
Improvethermal conductivityVSAvoidcost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter from conventional TIM with thermal conductivity limited to roughly 1 W/(m·K) to aluminum nitride ceramic with thermal conductivity of 200-500 W/(m·K). This parameter change eliminates the need for expensive high-performance TIM while achieving superior heat transfer through the case structure itself, thereby reducing overall manufacturing cost.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If electrical distribution assemblies operate with higher heat generation from increased complexity, then functionality is improved, but temperature control becomes difficult

Engineering Contradiction:
Improvefunctional complexityVSAvoidtemperature control
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent introduces the electrical case as a thermal intermediary component that actively conducts heat away from internal switching devices. The case serves as a heat sink and thermal pathway, mediating between the heat-generating components and the external environment, thereby enabling better temperature control in complex assemblies with multiple heat sources.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces temperatures within and around electrical distribution assemblies, preventing premature component failures and maintaining operational safety within industry-standard temperature ranges while maintaining structural integrity.

Implementation Method 1

a thermally conductive ceramic element comprising a dielectric material and at least a first portion and a second portion, said first portion being thermally coupled to the heat generating component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20170279252A1Dielectric heat transfer windows, and systems and methods using the same
Publication Date: 2017.09.28 EATON INTELLIGENT POWER LTD
  • US20170279252A1 patent drawing
  • US20170279252A1 patent drawing
  • US20170279252A1 patent drawing

AI summary

Devices, systems, and methods for dissipating heat from electrical distribution assemblies and electrical switching devices are described herein. In one non-limiting embodiment, a dielectric material of relatively high thermal conductivity can be thermally coupled to electrical switching devices to act as a dielectric heat transfer window that dissipates heat. The dielectric heat transfer window includes at least a first portion thermally coupled to a heat generating component within an electrical switching device, and a second portion disposed external to the electrical distribution assembly or electrical switching device. Among other benefits, this allows heat generated within the electrical switching device to escape the interior of the electrical switching device to an environment external to the electrical switching device.