Dielectric Heating Electrode Thermal Isolation
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Solution Overview
Problem
In small-size dielectric heating devices, heat transfer from the heating target through electrodes and wiring to the circuit and grounded surface reduces heating efficiency and causes high-temperature states in components.
Innovation Solution
The implementation of high-frequency passing heat-insulation elements that use electric or magnetic coupling between terminals to non-contactually connect the signal source and electrodes, preventing heat transfer while allowing high-frequency signals to pass through, and similarly connecting the grounded surface to electrodes, thereby reducing heat transfer to the component circuit and signal source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional direct contact connections are used between electrodes and circuit components, then electrical connection is simple and reliable, but heat transfers from the heating target through electrodes and wiring to the circuit and grounded surface, reducing heating efficiency and causing high-temperature states in components
Solution Approach 1:
The patent introduces high-frequency passing heat-insulation elements as intermediary components between the electrodes and the circuit components. These elements serve as mediators that allow high-frequency electrical signals to pass through while blocking heat transfer. The elements include a heat-insulation member with high-frequency passing properties and electrically conductive films on its surfaces, creating an indirect connection path that separates thermal and electrical functions.
Solution Approach 2:
The connection structure is segmented into distinct functional zones: the electrode, the high-frequency passing heat-insulation element, and the circuit component. This segmentation allows each component to perform its specific function optimally - the electrode generates heat, the insulation element blocks heat while passing signals, and the circuit component processes electricity without thermal interference.
2Temperature
If conventional direct contact connections are used between electrodes and circuit components, then the device structure is simple, but heat transfer causes component circuit and battery to reach high-temperature states
Solution Approach 1:
The high-frequency passing heat-insulation elements act as thermal barriers and intermediary components between the heating electrodes and the circuit components (signal source and grounded surface). These mediators prevent direct heat transfer to sensitive components while maintaining electrical signal transmission, thereby protecting components from high-temperature states.
3Volume of moving object
If the heating target is small in size, then the device can be miniaturized for portability, but heating efficiency is reduced due to increased relative heat loss through electrodes and wiring
Solution Approach 1:
The patent employs high-frequency passing heat-insulation elements as intermediary components that address the heating efficiency problem in miniaturized devices. By blocking heat transfer through the connection paths while maintaining signal transmission, these mediators prevent the disproportionate heat loss that occurs in small devices with large surface-area-to-volume ratios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heating efficiency by minimizing heat transfer to the component circuit and signal source, preventing high-temperature states and prolonging the device's lifetime.
Implementation Method 1
two terminals which are electrically or magnetically coupled mutually and without contact with each other to electronically connect the signal source and the second electrode in a non-contact manner
Implementation Method 2
two terminals which are electrically or magnetically coupled mutually and without contact with each other to electronically connect the signal source and the second electrode in a non-contact manner
Implementation Method 3
two terminals which are electronically or magnetically coupled mutually and without contact with each other to electronically connect the grounded service and the first electrode in a non-contact manner
Implementation Method 4
two terminals which are electronically or magnetically coupled mutually and without contact with each other to electronically connect the grounded service and the first electrode in a non-contact manner
Implementation Method 5
high-frequency passing heat-insulation elements that use electric or magnetic coupling between terminals to non-contactually connect the signal source and electrodes, preventing heat transfer while allowing high-frequency signals to pass through
Data Source
Figure 1
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AI summary
What is provided are: two or more electrodes (10a, 10b); a grounded surface (3) connected to one of the electrodes (10b); a signal source (2) that is connected to one of the electrodes (10a) other than the electrode connected to the grounded surface (3), and that outputs a high-frequency signal; a high-frequency passing heat-insulation element (11a) that is interposed serially between the signal source (2) and the electrode (10a) connected to the signal source (2), and that causes the high-frequency signal outputted from the signal source (2) to pass therethrough, by using electric coupling or magnetic coupling between two terminals (i, ii) in the element that are not connected to each other by metal; and a high-frequency passing heat-insulation element (11b) that is interposed serially between the grounded surface (3) and the electrode (10b) connected to the grounded surface (3), and that, by using electric coupling between two terminals (i, ii) therein, outputs the high-frequency signal outputted from the signal source (2), to the grounded surface (3).