Dielectric Holder for Quantum Devices Thermal Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current superconducting quantum circuits require significant space due to the size of substrates and suffer from thermal noise issues, limiting the number of qubits and connections, and existing cooling methods introduce noise through hot electrons and electromagnetic interference.
Innovation Solution
A dielectric holder system with substrates of high thermal conductivity materials, such as sapphire or silicon, is used to create a multi-layered structure with recesses for qubits, along with transmission lines to carry microwave signals, minimizing noise and optimizing qubit placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional substrates are used for quantum circuits, then the substrate area is large enough to accommodate qubits, but the thermal noise increases and qubit density decreases
Solution Approach 1:
The patent changes the thermal conductivity parameter of the substrate by selecting materials with high thermal conductivity (sapphire, silicon, diamond) to conduct away heat and reduce thermal noise, enabling higher qubit density without excessive noise accumulation
Solution Approach 2:
The patent employs composite material structures combining dielectric layers with high thermal conductivity substrates, creating a multi-layer system that simultaneously provides electrical insulation and thermal management for high-density qubit arrays
2Productivity
If more qubits are placed on the substrate, then quantum computing power increases, but thermal noise and electromagnetic interference increase
Solution Approach 1:
The patent divides the substrate into multiple segments with individual recesses for each qubit, isolating them physically and electrically while maintaining thermal connection to the substrate, reducing electromagnetic interference between adjacent qubits
Solution Approach 2:
The patent introduces dielectric layers as intermediary materials between qubits and substrates, providing electrical insulation while allowing thermal conduction, thus reducing electromagnetic interference while maintaining thermal management
3Temperature
If cooling methods are used to reduce thermal noise, then temperature decreases, but hot electrons and electromagnetic interference are introduced
Solution Approach 1:
The patent converts the harmful hot electrons generated during cooling into beneficial thermal conduction pathways by using high thermal conductivity substrates that rapidly conduct heat away, transforming the cooling byproduct into an effective heat removal mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces noise and increases qubit density by effectively managing thermal conductivity and signal transmission, enhancing the reliability and efficiency of quantum computing operations.
Implementation Method 1
a first substrate formed of a first material that exhibits a threshold level of thermal conductivity
Implementation Method 2
a transmission line configured to carry a microwave signal between the first substrate and the second substrate
Data Source
AI summary
A device includes a first substrate formed of a first material that exhibits a threshold level of thermal conductivity. The threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, the device also includes a second substrate disposed in a recess of the first substrate, the second substrate formed of a second material that exhibits a second threshold level of thermal conductivity. The second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, at least one qubit is disposed on the second substrate. In an embodiment, the device also includes a transmission line configured to carry a microwave signal between the first substrate and the second substrate.