Dielectric IMD Enclosures With Integrated Feedthroughs and Hermetic Sealing
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Solution Overview
Problem
Conventional implantable medical device (IMD) manufacturing processes using overmolding result in wasted space and increased costs due to yield fallout, necessitating a more efficient and cost-effective method for forming IMD enclosures.
Innovation Solution
The use of dielectric materials to form IMD headers with cavities, allowing for the integration of components within the header and a hermetic seal without the need for complex feedthrough assemblies, reducing manufacturing complexity and space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional overmolding processes are used to form IMD enclosures, then the housing can be formed with integrated components, but manufacturing complexity and costs increase due to yield fallout and wasted space
Solution Approach 1:
The IMD enclosure is divided into separate components: a header formed from non-conductive material and a housing formed from conductive material. These components are manufactured separately and then assembled together, eliminating the need for complex overmolding processes and reducing manufacturing complexity while improving efficiency.
Solution Approach 2:
The header and housing are combined through a coupling member with overlapping flanges that create a hermetic seal. This merging of separate components achieves the integration benefits of overmolding while avoiding its manufacturing complexities and yield fallout issues.
2Reliability
If conventional feedthrough assemblies are used to connect electrodes to internal circuitry, then electrical connections can be established, but device complexity and space requirements increase
Solution Approach 1:
The complex feedthrough assembly is extracted and replaced by a simpler configuration where the header itself serves as the insulating structure with integrated conduits. The electrode connects directly to internal circuitry through these conduits, eliminating the need for separate feedthrough assemblies and reducing device complexity while maintaining connection reliability.
3Reliability
If conventional feedthrough assemblies are used for hermetic sealing, then electrical connections can be maintained, but manufacturing complexity and space requirements increase
Solution Approach 1:
The hermetic sealing function is merged into the coupling member assembly. The overlapping flanges of the coupling member create the hermetic seal between the header and housing, eliminating the need for separate feedthrough assemblies that would otherwise be required for both electrical connection and sealing functions.
4Adaptability or versatility
If overmolding processes are used to form IMD housings, then integration of components is achieved, but manufacturing costs and time increase due to yield fallout
Solution Approach 1:
The IMD is segmented into separately manufacturable components (header and housing) that can be produced using simpler, more cost-effective processes. These components are then assembled using the coupling member, achieving component integration without the high costs and yield fallout associated with overmolding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances space utilization and reduces manufacturing costs by eliminating the need for overmolding and feedthrough assemblies, providing a more efficient and cost-effective IMD enclosure.
Implementation Method 1
The hermetic seal prevents moisture and contaminants from entering the IMD housing, protecting internal components
Implementation Method 2
The header is formed from a non-conductive material, which provides electrical insulation and supports the electrode and feedthrough assembly
Data Source
AI summary
Embodiments of the present disclosure relate to implantable medical device (IMD) enclosures. In an exemplary embodiment, an IMD comprises: a housing comprising an open end and a header defining a cavity and comprising at least one conduit through a wall of the header, wherein the header is formed from a non-conductive material. Further, the IMD comprises a coupling member comprising a flange, wherein the flange is configured to be received by the open end of the housing and wherein the flange and the open end of the housing at least partially overlap along an axial direction of the IMD when the flange is received by the open end. Additionally, the IMD comprises an electrode arranged on an outer surface of the header and a feedthrough coupled to the electrode and extending through the conduit of the header, wherein the feedthrough is configured to be coupled to internal circuity housed within the IMD. Further, the IMD comprises a ring forming a hermetic seal between the coupling member and the header.